المؤلفون: Seng, Audrey Long Wee, Yu, Liu, Shyan, Pang Hui, Murali, Sarangapani, Kumar, Balasubramanian Senthil, Sungsig, Kang SS

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :392-396 Dec, 2022

Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Jason, Lim Chze Min, Kumar, B. Senthil, Sungsig, Kang, Huei, Yam Lip, Fen, Zhang Rui, Murali, Sarangapani

المصدر: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) Electronics Manufacturing Technology Conference (IEMT), 2022 IEEE 39th International. :1-5 Oct, 2022

Relation: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)

المؤلفون: Sylvia Sutino, Sebastian Fritzsche, Li-San Chan, Santosh Kumar Rath, Chieng Yu Yuan, Balasubramanian Senthil Kumar, Joel Agala, HanWen Zhang, Yam Lip Huei, Lo Yee Ting, Stefan Mausner, Sungsig Kang

المصدر: International Symposium on Microelectronics. 2020:000025-000033

مصطلحات موضوعية: Materials science, Automotive Engineering, Metallurgy, Solder paste

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d371e19c5773fce84b22710f8e79de90
https://doi.org/10.4071/2380-4505-2020.1.000025

المؤلفون: Rath, Santosh Kumar, Yam Lip Huei, Sutino, Sylvia, Chieng Yu Yuan, Balasubramanian, Senthil Kumar, Yee Ting Lo, Agala, Joel, HanWen Zhang, Li-San Chan, Sungsig Kang, Mausner, Stefan, Fritzsche, Sebastian

المصدر: Advancing Microelectronics; Sep/Oct2021, Vol. 48 Issue 5, p12-18, 7p

مصطلحات موضوعية: SOLDER pastes, CLEANING compounds, POWDERS, STENCIL work