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المؤلفون: X. Zhang, Christopher J. Penny, J. Ren, O. van der Straten, Sunny Chiang, J. Maniscalco, Paul F. Ma
المصدر: ECS Transactions. 50:159-164
مصطلحات موضوعية: Materials science, Tantalum, Copper interconnect, chemistry.chemical_element, Nanotechnology, Substrate (electronics), chemistry.chemical_compound, Atomic layer deposition, chemistry, Tantalum nitride, Electrical resistivity and conductivity, Physical vapor deposition, Composite material, Electroplating
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المؤلفون: Ming He, Cathryn Christiansen, Kunaljeet Tanwar, Frieder H. Baumann, Patrick W. DeHaven, Samuel S. Choi, J. Rowland, T. Ryan, Hoon Kim, Leo Tai, A. Simon, Anita Madan, Donald F. Canaperi, Tibor Bolom, X. Zhang, Steven E. Molis, F. Ito, Akira Uedono, Philip L. Flaitz, C.-K. Hu, R. J. Davis, Daniel C. Edelstein, R. Murphy, Christopher Parks, Christopher J. Penny, Terry A. Spooner, James J. Kelly, James Chingwei Li, Sunny Chiang, Takeshi Nogami
المصدر: 2012 International Electron Devices Meeting.
مصطلحات موضوعية: Metal, Materials science, visual_art, Metallurgy, Alloy, engineering, visual_art.visual_art_medium, Mn alloy, Chemical vapor deposition, engineering.material, Layer (electronics), Electromigration
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9b1ee2ead5d524ea8e6cbaf07bb70bf8
https://doi.org/10.1109/iedm.2012.6479161 -
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المؤلفون: M. Zaitz, Sunny Chiang, Samuel S. Choi, Terry A. Spooner, R. Murphy, A. Simon, Leo Tai, H. Chen, J. Ren, J. Fine, Kazumichi Tsumura, Patrick W. DeHaven, Takeshi Nogami, R. J. Davis, Vivian W. Ryan, Donald F. Canaperi, P. Kozlowski, B. St. Lawrence, J. Schmatz, Philip L. Flaitz, Tibor Bolom, Christopher Parks, Christopher J. Penny, Joseph F. Aubuchon, J. Maniscalco, Daniel C. Edelstein, Tuan A. Vo, Timothy M. Shaw, Paul F. Ma, James J. Kelly, S-H. Rhee, Oscar van der Straten, Anita Madan, B-Y. Kim, Cyril Cabral, C.-K. Hu, Stephan A. Cohen, Fuminori Ito
المصدر: 2010 IEEE International Interconnect Technology Conference.
مصطلحات موضوعية: Materials science, Diffusion barrier, Annealing (metallurgy), Metallurgy, Oxide, Copper interconnect, chemistry.chemical_element, Chemical vapor deposition, Copper, chemistry.chemical_compound, chemistry, X-ray photoelectron spectroscopy, Chemical engineering, Cobalt
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::56aa40debcf55e562b1da16592cbfd47
https://doi.org/10.1109/iitc.2010.5510584 -
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المؤلفون: James Ren, James J. Kelly, M. Fujiwara, Takamasa Usui, Kazunari Ishimaru, Terry A. Spooner, Sunny Chiang, Tuan Vo, T. Watanabe, Mariko Takayanagi, Atsunobu Isobayashi, Charles W. Koburger, J. Maniscalco
المصدر: 2009 IEEE International Interconnect Technology Conference.
مصطلحات موضوعية: Materials science, business.industry, Annealing (metallurgy), Contact resistance, chemistry.chemical_element, Contact hole, Copper, CMOS, chemistry, Sputtering, Electronic engineering, Optoelectronics, Wafer, business, Wide gap
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::72f876202ad36a9abfe6c2156fb72fdb
https://doi.org/10.1109/iitc.2009.5090325 -
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المؤلفون: Stefan J. Weber, L. Yang, G.Z. Lu, R.F. Schnabel, D. Tobben, Chenting Lin, J. L. Hurd, Sunny Chiang, R. Filippi, J. Ning, Kenneth P. Rodbell, T. Gou, R. Longo, M. Ronay, Roderick C. Mosely, L. Gignac, Mark Hoinkis, R. Ploessl, S. Voss, Clevenger Leigh Anne H, Jeffrey P. Gambino, Lian-Yuh Chen, G. Costrini, D.M. Dobuzinsky, J.F. Nuetzel, R. C. Iggulden
المصدر: Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102).
مصطلحات موضوعية: Back end of line, Materials science, Etching (microfabrication), Cost effectiveness, business.industry, Chemical-mechanical planarization, Electronic engineering, Copper interconnect, Optoelectronics, business, Aspect ratio (image), Electromigration, Dram
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5df924822bf795c7e3a2be9c96ec3aef
https://doi.org/10.1109/iitc.1998.704772 -
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المؤلفون: Sunny Chiang, Jaim Nulman, Keith J. Hansen, Sesh Ramaswami, Murali Narasimhan, Murali Abburi, Vikram Pavate, Glen T. Mori, Daryl Restaino
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Yield (engineering), Materials science, Alloy, chemistry.chemical_element, Sputter deposition, engineering.material, law.invention, chemistry, Optical microscope, Aluminium, Sputtering, law, engineering, Metallizing, Composite material, Porosity
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::414c3b2e6e57fdb96a0bbb5767b3b406
https://doi.org/10.1117/12.304398 -
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المؤلفون: Sesh Ramaswami, Glen T. Mori, Daryl Restaino, Murali Abburi, Keith J. Hansen, Sunny Chiang, Vikram Pavate, Jaim Nulman, Murali Narasimhan
المصدر: Multilevel Interconnect Technology.
مصطلحات موضوعية: Materials science, Yield (engineering), Semiconductor device fabrication, Metallurgy, Alloy, chemistry.chemical_element, engineering.material, Sputter deposition, Electric arc, chemistry, Sputtering, Aluminium, engineering, Porosity
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d305a8b3debdb8710c25e8ad893de7fd
https://doi.org/10.1117/12.284663 -
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المؤلفون: Jenn Min Lee, Kueih-Tzu Lu, Shi Wei Chen, Jyh-Fu Lee, Sunny Chiang, Mau Tsu Tang, Chih Wen Pao, Jin-Ming Chen, Yu Chia Liang, Shu Chih Haw
المصدر: Journal of the Physical Society of Japan. 80:114706
مصطلحات موضوعية: Valence (chemistry), Materials science, Absorption edge, Absorption spectroscopy, chemistry, Band gap, Doping, Analytical chemistry, General Physics and Astronomy, chemistry.chemical_element, Electronic structure, Oxygen, Visible spectrum
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المؤلفون: Fang Zhang, Sunny Chiang, Rudi Hendel
المصدر: MRS Proceedings. 260
مصطلحات موضوعية: Materials science, business.industry, chemistry.chemical_element, Integrated circuit, Semiconductor device, Nitride, Titanium nitride, law.invention, chemistry.chemical_compound, chemistry, Sputtering, law, Optoelectronics, business, Tin
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المؤلفون: Qiang Huang, John Dukovic, Sunny Chiang, Xiaoyan Shao, James J. Kelly, O. van der Straten, Brett Baker O'Neal, Tuan Vo
المصدر: ECS Meeting Abstracts. :1897-1897
مصطلحات موضوعية: Materials science, Morphology (linguistics), Chemical engineering