المؤلفون: Rahman, A.^Aff9, Mazumder, D.^Aff9, Haque, R.^Aff9, Sutradhar, G.^Aff10, Haidar, S.^Aff9

المساهمون: Ghosh, Arindam, Series Editor^Aff1, Chua, Daniel, Series Editor^Aff2, de Souza, Flavio Leandro, Series Editor^Aff3, Aktas, Oral Cenk, Series Editor^Aff4, Han, Yafang, Series Editor^Aff5, Gong, Jianghong, Series Editor^Aff6, Jawaid, Mohammad, Series Editor^Aff7, Swain, Bibhu Prasad, editor^Aff8

المصدر: Recent Advances in Materials : Select Proceedings of ICSTE 2023. 25:157-166

المؤلفون: Sikder, R., Chakravarty, S., Haldar, P.^{Aff2, IDs1376202204257x_cor3}, Nandi, T., Sutradhar, G.

المصدر: International Journal of Environmental Science and Technology. 20(6):7019-7028

المؤلفون: Chakravarty, S., Haldar, P.^{Aff2, IDs1376202103574x_cor2}, Nandi, T., Sutradhar, G.

المصدر: International Journal of Environmental Science and Technology. 20(1):1169-1184

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المؤلفون: Dhar, A.K., Sutradhar, G.

المصدر: In Materials Today: Proceedings 2022 62 Part 2:1083-1088

المؤلفون: Das, T., Mahata, C., Dalapati, G.K, Chi, D., Sutradhar, G., Bose, P.K., Maiti, C. K.

المصدر: 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the. :1-4 Jul, 2010

Relation: 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010)

المؤلفون: Sarkar, T.^Aff1, Bose, P. K., Sutradhar, G.

المصدر: Metal Science and Heat Treatment. 61(9-10):552-558

المؤلفون: Das, T., Mahata, C., Dalapati, G.K, Chi, D.Z., Sutradhar, G., Bose, P.K., Maiti, C. K.

المصدر: 2009 4th International Conference on Computers and Devices for Communication (CODEC) Computers and Devices for Communication, 2009. CODEC 2009. 4th International Conference on. :1-4 Dec, 2009

Relation: 2009 International Conference on Computers and Devices for Communication (CODEC)

المؤلفون: Das, T., Mahata, C., Dalapati, G.K, Chi, D., Sutradhar, G., Bose, P.K., Maiti, C. K.

المصدر: 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the. :130-133 Jul, 2009

Relation: 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: S.Banerjee, Sutradhar, G.

المصدر: In Materials Today: Proceedings 2018 5(9) Part 3:17664-17673