يعرض 1 - 10 نتائج من 33 نتيجة بحث عن '"Swan, Johanna"', وقت الاستعلام: 1.67s تنقيح النتائج
  1. 1
    مؤتمر
    Process Development and Performance Benefits of 0.64-0.36 μm Pitch Hybrid Bonding on Intel Process

    المؤلفون: Talukdar, Tushar, Elsherbini, Adel, Rawlings, Brandon, Vreeland, Richard, Brezinski, William, Dong, Siyan, Niazi, Haris Khan, Liu, Pilin, Shi, Yi, Tabassum, Natasha, Sathe, Ajay, Ajayi, Taiwo, Bedoya, Felipe, Tiagaraj, Sathya Narasimman, Pasdast, Gerald, Jun, Kimin, Brun, Xavier, Swan, Johanna

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :784-789 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  2. 2
    مؤتمر
    Organic Interposers Using Zero-Misalignment-Via Technology and Silicon Wafer Carriers for Large Area Wafer-Level Package Applications

    المؤلفون: Aleksov, Aleksandar, Talukdar, Tushar, Strong, Veronica, Sounart, Thomas, Sawyer, Holly, Aubertine, Carolyn, Swan, Johanna

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :842-848 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  3. 3
    مؤتمر
    Zero-misalignment Technology Achieves 333 IO/mm/layer on Mold

    المؤلفون: Strong, Veronica, Widodo, Trianggono, Sawyer, Holly, Aubertine, Carolyn, Aleksov, Aleksandar, Swan, Johanna

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :587-591 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  4. 4
    مؤتمر
    IR Laser Debond From Silicon Carrier Wafers With Inorganic Thin Film Release Layers for High-Density 2.5D and 3D Integration

    المؤلفون: Sounart, Thomas, Talukdar, Tushar, Braunisch, Henning, Aleksov, Aleksandar, Jun, Kimin, Elsherbini, Adel, Nordeen, Paul, Rawlings, Brandon, Strong, Veronica, Liff, Shawna, Swan, Johanna

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :363-369 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  5. 5
    مؤتمر
    Integration And Process Challenges Of Self Assembly Applied To Die-To-Wafer Hybrid Bonding

    المؤلفون: Bourjot, Emilie, Bond, Alice, Nadi, Noura, Enot, Thierry, Sanchez, Loic, Montmeat, Pierre, Martin, Benoit, Campo, Alain, Fournel, Frank, Eid, Feras, Swan, Johanna

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1397-1402 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  6. 6
    مؤتمر
    Collective Die-to-Wafer Self-Assembly for High Alignment Accuracy and High Throughput 3D Integration

    المؤلفون: Bond, Alice, Bourjot, Emilie, Borel, Stephan, Enot, Thierry, Montmeat, Pierre, Sanchez, Loic, Fournel, Frank, Swan, Johanna

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :168-176 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  7. 7
    مؤتمر
    Cold Spray: A Disruptive Technology for Enabling Novel Packaging Thermomechanical Solutions

    المؤلفون: Eid, Feras, Uppal, Aastha, Swan, Johanna

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1109-1114 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  8. 8
    مؤتمر
    Hybrid Bonding Interconnect for Advanced Heterogeneously Integrated Processors

    المؤلفون: Elsherbini, Adel, Liff, Shawna, Swan, Johanna, Jun, Kimin, Tiagaraj, Sathya, Pasdast, Gerald

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1014-1019 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  9. 9
    مؤتمر
    Scaling Solder Micro-Bump Interconnect Down to $10\ \mu\mathrm{m}$ Pitch for Advanced 3D IC Packages

    المؤلفون: Li, Zhaozhi, Tomita, Yoshihiro, Elsherbini, Adel A., Liu, Pilin, Sawyer, Holly A., Swan, Johanna M., Liff, Shawna M.

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :451-456 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  10. 10
    مؤتمر
    Enabling Hybrid Bonding on Intel Process

    المؤلفون: Elsherbini, Adel, Jun, Kimin, Vreeland, Richard, Brezinski, William, Niazi, Haris Khan, Shi, Yi, Yu, Qiang, Qian, Zhiguo, Xu, Jessica, Liff, Shawna, Swan, Johanna, Yao, Jimin, Liu, Pilin, Pelto, Christopher, Rami, Said, Balankutty, Ajay, Fischer, Paul, Turkot, Bob

    المصدر: 2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :34.3.1-34.3.4 Dec, 2021

    Relation: 2021 IEEE International Electron Devices Meeting (IEDM)

    Full Text Finder
    أضف إلى المفضلة
أدوات البحث: أحصل على تغذية RSS – أرسل هذا البحث بالبريد الإلكتروني – حفظ البحث – جدول التنبيهات: لا شيء