المؤلفون: Movahedi, Nima^{Aff1, IDs11665024098255_cor1}, Fiedler, Thomas, Sarıkaya, Mustafa, Taşdemirci, Alper, Murch, Graeme E., Belova, Irina V., Güden, Mustafa

المصدر: Journal of Materials Engineering and Performance. :1-12

المؤلفون: Saxena, Mukul, Sharma, Anuj Kumar, Srivastava, Ashish Kumar^{Aff2, IDs1200802301277w_cor3}, Singh, Monika, Saxena, Kuldeep Kumar, Prakash, Chandar, Abass, Mayada Ahmed

المصدر: International Journal on Interactive Design and Manufacturing (IJIDeM). 18(8):5663-5670

المؤلفون: Li, Yuefang, Li, Xiang

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Swidan, Ahmed, Joiner, Keith, Jewson, Edison, Carroll, Nicolas, Champ, David, Shpak, Gennady

المصدر: 2022 International Telecommunications Conference (ITC-Egypt) Telecommunications Conference (ITC-Egypt), 2022 International. :1-5 Jul, 2022

Relation: 2022 International Telecommunications Conference (ITC-Egypt)

المؤلفون: Karjagi, Pratik M^Aff15, Guruprasad^Aff15, Rao, Athiksh C^Aff15, Mohan, R^Aff15, Srinivasa Prasad, K S^Aff15

المساهمون: Chaari, Fakher, Series Editor^Aff1, Gherardini, Francesco, Series Editor^Aff2, Ivanov, Vitalii, Series Editor^Aff3, Haddar, Mohamed, Series Editor^Aff4, Cavas-Martínez, Francisco, Editorial Board Member^Aff5, di Mare, Francesca, Editorial Board Member^Aff6, Kwon, Young W., Editorial Board Member^Aff7, Tolio, Tullio A. M., Editorial Board Member^Aff8, Trojanowska, Justyna, Editorial Board Member^Aff9, Schmitt, Robert, Editorial Board Member^Aff10, Xu, Jinyang, Editorial Board Member^Aff11, Chandrashekara, C. V., editor^Aff12, Mathivanan, N. Rajesh, editor^Aff13, Hariharan, K., editor^Aff14

المصدر: Recent Advances in Materials and Manufacturing : Proceedings of ISME 2023. :109-116

المؤلفون: Afolabi, Olusegun Adigun^{Aff1, IDs43939023000706_cor1}, Mohan, Turup Pandurangan, Kanny, Krishnan

المصدر: Discover Materials. 4(1)

المؤلفون: Ping Wang, Shun Zhong, Kaiqi Yan, Bin Liao, Yuanyuan Guo, Jingjie Zhang

المصدر: Journal of Materials Research and Technology, Vol 30, Iss , Pp 2264-2271 (2024)

مصطلحات موضوعية: Hollow glass microspheres, Surface modification, Syntactic foam, Compressive strength, Fracture mechanism, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785424007804; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/74f0d00e3a344474aebca5dca76f4b11

المؤلفون: Gerlach, Robert, Machetti, Diego, Willems, Martin, Puffer, Ralf

المصدر: 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) Electrical Insulation and Dielectric Phenomena (CEIDP), 2021 IEEE Conference on. :9-12 Dec, 2021

Relation: 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)

المؤلفون: Antony, Thomas, Kumar, Ramesh, Kumar, K Rajeev, Madhusoodanan, K N

المصدر: 2021 International Symposium on Ocean Technology (SYMPOL) Ocean Technology (SYMPOL), 2021 International Symposium on. :1-5 Dec, 2021

Relation: 2021 International Symposium on Ocean Technology (SYMPOL)

المؤلفون: Antony, Thomas, Kumar, Ramesh, Rajesh, R, Kumar, K Rajeev, Madhusoodanan, K N

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Relation: 2021 International Symposium on Ocean Technology (SYMPOL)