المؤلفون: Flores-Reyes, M., Zepeda-Peralta, J. H., Vera-Hernandez, A., Leija-Salas, L.

المصدر: 2024 Global Medical Engineering Physics Exchanges/ Pan American Health Care Exchanges (GMEPE/PAHCE) Global Medical Engineering Physics Exchanges/ Pan American Health Care Exchanges (GMEPE/PAHCE), 2024. :1-5 Apr, 2024

Relation: 2024 Global Medical Engineering Physics Exchanges/ Pan American Health Care Exchanges (GMEPE/PAHCE)

المؤلفون: Zhou, J., Huang, J., Ma, X., Lee, A., Kosuge, K., Liu, Y.

المصدر: IEEE/ASME Transactions on Mechatronics IEEE/ASME Trans. Mechatron. Mechatronics, IEEE/ASME Transactions on. 29(2):889-901 Apr, 2024

المؤلفون: Alrikabi, Hayder, Alrikabi, Amjad, Alazawi, Aws, Humaidi, Amiad Jaleel, Amer, Hayder Kareem

المصدر: 2023 IEEE 11th Conference on Systems, Process & Control (ICSPC) Systems, Process & Control (ICSPC), 2023 IEEE 11th Conference on. :28-32 Dec, 2023

Relation: 2023 IEEE 11th Conference on Systems, Process & Control (ICSPC)

المؤلفون: Saqlain, Md. Golam, Uddin, Mohammad Rejwan, Mahmood, Asif, Hasan, Mahady

المصدر: 2023 26th International Conference on Computer and Information Technology (ICCIT) Computer and Information Technology (ICCIT), 2023 26th International Conference on. :1-5 Dec, 2023

Relation: 2023 26th International Conference on Computer and Information Technology (ICCIT)

المؤلفون: Jung, Yuna, Gulick, Daniel, Christen, Jennifer Blain

المصدر: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2023 IEEE 66th International Midwest Symposium on. :293-297 Aug, 2023

Relation: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)

المؤلفون: Hunde, Bonsa Regassa^{Aff1, Aff2, IDs00170024135887_cor1}, Woldeyohannes, Abraham Debebe^{Aff1, Aff2}

المصدر: The International Journal of Advanced Manufacturing Technology. 132(11-12):5537-5556

المؤلفون: Sadhana, Tharatya Kartika, Sardjono, Tri Arief, Fatoni, Muhammad Hilman

المصدر: 2022 International Conference on Computer Engineering, Network, and Intelligent Multimedia (CENIM) Computer Engineering, Network, and Intelligent Multimedia (CENIM), 2022 International Conference on. :157-161 Nov, 2022

Relation: 2022 International Conference on Computer Engineering, Network, and Intelligent Multimedia (CENIM)

المؤلفون: Messaoudi, Meriem^{Aff1, IDs11082024072167_cor1}, Lamiri, Leila, Boudour, Samah, Beddek, Lynda, Dekhili, Mohamed, Belgherbi, Ouafia, Khemliche, Hamza, Aida, Mohammed Salah, Attaf, Nadir

المصدر: Optical and Quantum Electronics. 56(8)

المؤلفون: Dhone, Komal Ashok^Aff41, Joshi, Sonali^Aff41, Sonaskar, Sandeep^Aff42

المساهمون: Angrisani, Leopoldo, Series Editor^Aff1, Arteaga, Marco, Series Editor^Aff2, Chakraborty, Samarjit, Series Editor^Aff3, Chen, Jiming, Series Editor^Aff4, Chen, Shanben, Series Editor^Aff5, Chen, Tan Kay, Series Editor^Aff6, Dillmann, Rüdiger, Series Editor^Aff7, Duan, Haibin, Series Editor^Aff8, Ferrari, Gianluigi, Series Editor^Aff9, Ferre, Manuel, Series Editor^Aff10, Jabbari, Faryar, Series Editor^Aff11, Jia, Limin, Series Editor^Aff12, Kacprzyk, Janusz, Series Editor^Aff13, Khamis, Alaa, Series Editor^Aff14, Kroeger, Torsten, Series Editor^Aff15, Li, Yong, Series Editor^Aff16, Liang, Qilian, Series Editor^Aff17, Martín, Ferran, Series Editor^Aff18, Ming, Tan Cher, Series Editor^Aff19, Minker, Wolfgang, Series Editor^Aff20, Misra, Pradeep, Series Editor^Aff21, Mukhopadhyay, Subhas, Series Editor^Aff22, Ning, Cun-Zheng, Series Editor^Aff23, Nishida, Toyoaki, Series Editor^Aff24, Oneto, Luca, Series Editor^Aff25, Panigrahi, Bijaya Ketan, Series Editor^Aff26, Pascucci, Federica, Series Editor^Aff27, Qin, Yong, Series Editor^Aff28, Seng, Gan Woon, Series Editor^Aff29, Speidel, Joachim, Series Editor^Aff30, Veiga, Germano, Series Editor^Aff31, Wu, Haitao, Series Editor^Aff32, Zamboni, Walter, Series Editor^Aff33, Zhang, Junjie James, Series Editor^Aff34, Tan, Kay Chen, Series Editor^Aff35, Shaw, Rabindra Nath, editor^Aff36, Siano, Pierluigi, editor^Aff37, Makhilef, Saad, editor^Aff38, Ghosh, Ankush, editor^Aff39, Shimi, S. L., editor^Aff40

المصدر: Innovations in Electrical and Electronic Engineering : Proceedings of ICEEE 2023, Volume 2. 1115:633-645

المؤلفون: da Palma Valério, Mariana^Aff11, Pinheiro, S.^Aff11, Silva, A. R. F.^Aff11, Moura, L. A.^Aff11, Boschi, S. R. M. S.^Aff11, Martini, S. C.^Aff11, Scardovelli, T. A.^Aff11, Silva, A. P.^Aff11

المساهمون: Magjarević, Ratko, Series Editor^Aff1, Ładyżyński, Piotr, Associate Editor^Aff2, Ibrahim, Fatimah, Associate Editor^Aff3, Lackovic, Igor, Associate Editor^Aff4, Rock, Emilio Sacristan, Associate Editor^Aff5, Marques, Jefferson Luiz Brum, editor^Aff6, Rodrigues, Cesar Ramos, editor^Aff7, Suzuki, Daniela Ota Hisayasu, editor^Aff8, Marino Neto, José, editor^Aff9, García Ojeda, Renato, editor^Aff10

المصدر: IX Latin American Congress on Biomedical Engineering and XXVIII Brazilian Congress on Biomedical Engineering : Proceedings of CLAIB and CBEB 2022, October 24–28, 2022, Florianópolis, Brazil—Volume 3: Biomechanics, Biomedical Devices and Assistive Technologies. 100:376-384