يعرض 1 - 10 نتائج من 14,417 نتيجة بحث عن '"TEC"', وقت الاستعلام: 1.48s تنقيح النتائج
  1. 1
    مؤتمر
    Ionospheric Scintillation Prediction Using Decision Tree and Rainforest Techniques

    المؤلفون: Trachuentong, Sirasake, Supnithi, Pornchai, Myint, Lin Min Min, Saito, Susumu

    المصدر: 2024 10th International Conference on Engineering, Applied Sciences, and Technology (ICEAST) Engineering, Applied Sciences, and Technology (ICEAST), 2024 10th International Conference on. :89-92 May, 2024

    Relation: 2024 10th International Conference on Engineering, Applied Sciences, and Technology (ICEAST)

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  2. 2
    دورية أكاديمية
    A Compact Temperature Controller for MEMS Vibratory Gyroscopes Using Thermoelectric Cooler

    المؤلفون: Wang, Z., Zhou, Y., Jiang, B., Zhang, J., Zhou, T., Su, Y.

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(6):3888-3894 Jun, 2024

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  3. 3
    دورية أكاديمية
    Dynamic Microservice Deployment and Offloading for Things–Edge–Cloud Computing

    المؤلفون: Tian, X., Meng, H., Shen, Y., Zhang, J., Chen, Y., Li, Y.

    المصدر: IEEE Internet of Things Journal IEEE Internet Things J. Internet of Things Journal, IEEE. 11(11):19537-19548 Jun, 2024

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  4. 4
    مؤتمر
    IoT Empowered GNSS Tracking in Real-time via Cloud Infrastructure

    المؤلفون: Naidu Vadlamudi, Muniraju, Jayanthi, Neelampalli, Swetha, G, Nishitha, P, Al-Salman, Ghafar Ahmed, Saikumar, K.

    المصدر: 2024 IEEE 9th International Conference for Convergence in Technology (I2CT) Convergence in Technology (I2CT), 2024 IEEE 9th International Conference for. :1-6 Apr, 2024

    Relation: 2024 IEEE 9th International Conference for Convergence in Technology (I2CT)

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  5. 5
    مؤتمر
    An Integrated Approach to Energy Harvesting and Power Management Systems: A Comprehensive Analysis

    المؤلفون: Singh, Kamred Udham, Vikash, Sharma, Bhavesh Kumar, Singh, Teekam, Varshney, Neeraj, Agrawal, Dheeraj

    المصدر: 2024 International Conference on Automation and Computation (AUTOCOM) Automation and Computation (AUTOCOM), 2024 International Conference on. :640-645 Mar, 2024

    Relation: 2024 International Conference on Automation and Computation (AUTOCOM)

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  6. 6
    مؤتمر
    Low-Latitude Indian Ionospheric TEC Variations during Geomagnetic Quiet and Disturbed Days

    المؤلفون: P, Chaithra, B, Ramesh Krishna, Kamsali, Nagaraja

    المصدر: 2024 IEEE International Conference for Women in Innovation, Technology & Entrepreneurship (ICWITE) Women in Innovation, Technology & Entrepreneurship (ICWITE), 2024 IEEE International Conference for. :26-29 Feb, 2024

    Relation: 2024 IEEE International Conference for Women in Innovation, Technology & Entrepreneurship (ICWITE)

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  7. 7
    دورية أكاديمية
    Dynamic Thermal Management in SOI Transistors Using Holey Silicon-Based Thermoelectric Cooling

    المؤلفون: Luo, J., Lim, J., Chen, J., Venugopal, A., Ren, Z., Lee, J.

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(4):2577-2584 Apr, 2024

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  8. 8
    دورية أكاديمية
    A 12-μm Pixel Pitch 640×512 Resolution 120 °C Operating Range TEC-Less Bolometric Infrared Imager With Ultra Low Responsivity Drift

    المؤلفون: Shi, X., Liu, D., Yu, S., Zhang, Y., Lu, W., Chen, Z.

    المصدر: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 71(3):1072-1076 Mar, 2024

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  9. 9
    دورية أكاديمية
    Collaborative Computing Optimization in Train-Edge-Cloud-Based Smart Train Systems Using Risk-Sensitive Reinforcement Learning

    المؤلفون: Zhu, L., Lin, S., Yu, F.R., Li, Y.

    المصدر: IEEE Transactions on Vehicular Technology IEEE Trans. Veh. Technol. Vehicular Technology, IEEE Transactions on. 73(3):3129-3141 Mar, 2024

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  10. 10
    دورية أكاديمية
    A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging

    المؤلفون: Hu, S., Song, J., Liu, Y., Wu, C., Lei, T., Ge, A., Zhang, D., Zhao, X., Huo, Y., Lee, C.C.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(2):328-341 Feb, 2024

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