يعرض 1 - 10 نتائج من 375 نتيجة بحث عن '"TGp"', وقت الاستعلام: 1.11s تنقيح النتائج
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    دورية أكاديمية

    المؤلفون: Chen, Y., Wu, Y., Yang, H., Cao, J., Wang, Q., Liu, Y.

    المصدر: IEEE Robotics and Automation Letters IEEE Robot. Autom. Lett. Robotics and Automation Letters, IEEE. 9(3):2064-2071 Mar, 2024

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    دورية أكاديمية

    المؤلفون: Goh, S.K., Singh, N.P., Lim, Z.J., Alam, S.

    المصدر: IEEE Transactions on Aerospace and Electronic Systems IEEE Trans. Aerosp. Electron. Syst. Aerospace and Electronic Systems, IEEE Transactions on. 59(3):2658-2671 Jun, 2023

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    كتاب إلكتروني

    المؤلفون: Yang, QilinAff13, Shang, QianqianAff13, Xu, HuiAff13, Xu, MinAff14

    المساهمون: di Prisco, Marco, Series EditorAff1, Chen, Sheng-Hong, Series EditorAff2, Vayas, Ioannis, Series EditorAff3, Kumar Shukla, Sanjay, Series EditorAff4, Sharma, Anuj, Series EditorAff5, Kumar, Nagesh, Series EditorAff6, Wang, Chien Ming, Series EditorAff7, Li, Yun, editorAff8, Hu, Yaan, editorAff9, Rigo, Philippe, editorAff10, Lefler, Francisco Esteban, editorAff11, Zhao, Gensheng, editorAff12

    المصدر: Proceedings of PIANC Smart Rivers 2022 : Green Waterways and Sustainable Navigations. 264:1502-1511

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    مؤتمر

    المؤلفون: Chen, Ruey-Maw, Wang, Chuin-Mu

    المصدر: 2016 International Symposium on Computer, Consumer and Control (IS3C) Computer, Consumer and Control (IS3C), 2016 International Symposium on. :502-505 Jul, 2016

    Relation: 2016 International Symposium on Computer, Consumer and Control (IS3C)

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    مؤتمر

    المصدر: Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on. :1235-1243 May, 2014

    Relation: 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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    كتاب إلكتروني

    المؤلفون: Siu, Kin Wai MichaelAff15, Aff16, Lo, Chi HangAff17

    المساهمون: Kacprzyk, Janusz, Series EditorAff1, Gomide, Fernando, Advisory EditorAff2, Kaynak, Okyay, Advisory EditorAff3, Liu, Derong, Advisory EditorAff4, Pedrycz, Witold, Advisory EditorAff5, Polycarpou, Marios M., Advisory EditorAff6, Rudas, Imre J., Advisory EditorAff7, Wang, Jun, Advisory EditorAff8, Shin, Cliff Sungsoo, editorAff9, Di Bucchianico, Giuseppe, editorAff10, Fukuda, Shuichi, editorAff11, Ghim, Yong-Gyun, editorAff12, Montagna, Gianni, editorAff13, Carvalho, Cristina, editorAff14

    المصدر: Advances in Industrial Design : Proceedings of the AHFE 2021 Virtual Conferences on Design for Inclusion, Affective and Pleasurable Design, Interdisciplinary Practice in Industrial Design, Kansei Engineering, and Human Factors for Apparel and Textile Engineering, July 25-29, 2021, USA. 260:289-299

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