المؤلفون: Arredondo-Velazquez, Moises, Marquez Carranza, Arturo A., Barbosa, Eduardo Moreno

المصدر: 2024 47th International Conference on Telecommunications and Signal Processing (TSP) Telecommunications and Signal Processing (TSP), 2024 47th International Conference on. :223-226 Jul, 2024

Relation: 2024 47th International Conference on Telecommunications and Signal Processing (TSP)

المؤلفون: Nikulin, Andrey V., Smirnov, Viktor V., Kazmina, Anna S.

المصدر: 2024 IEEE 25th International Conference of Young Professionals in Electron Devices and Materials (EDM) Young Professionals in Electron Devices and Materials (EDM), 2024 IEEE 25th International Conference of. :440-443 Jun, 2024

Relation: 2024 IEEE 25th International Conference of Young Professionals in Electron Devices and Materials (EDM)

المؤلفون: Kar, Deblina, Mandal, Shyamal Kumar Das, Bhattacharya, Tarun Kanti

المصدر: 2024 International Conference on Innovations and Challenges in Emerging Technologies (ICICET) Innovations and Challenges in Emerging Technologies (ICICET), 2024 International Conference on. :1-6 Jun, 2024

Relation: 2024 International Conference on Innovations and Challenges in Emerging Technologies (ICICET)

المؤلفون: Wu, J., Lv, D., Wan, C., Li, J., Zheng, L.

المصدر: IEEE Sensors Letters IEEE Sens. Lett. Sensors Letters, IEEE. 8(7):1-4 Jul, 2024

المؤلفون: Piron, F., Pierre, H., Redoute, J.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(13):20495-20503 Jul, 2024

المؤلفون: Liu, Z., Chen, R., Jiang, C., Ye, F., Guo, G., Chen, L., Lin, X.

المصدر: IEEE Internet of Things Journal IEEE Internet Things J. Internet of Things Journal, IEEE. 11(12):21916-21929 Jun, 2024

المؤلفون: Shi, B., Su, M., Ma, R., Chen, C., You, X., Ding, F., Wang, Q., Cao, L.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(6):1036-1042 Jun, 2024

المؤلفون: Wojtkiewicz, M., Rae, B., Henderson, R.K.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(6):3470-3477 Jun, 2024

المؤلفون: Ren, Z., Sidky, E.Y., Barber, R.F., Kao, C., Pan, X.

المصدر: IEEE Transactions on Medical Imaging IEEE Trans. Med. Imaging Medical Imaging, IEEE Transactions on. 43(6):2347-2357 Jun, 2024

المؤلفون: Newel, Evan, Motta, Renzo Garza, Arafat, Jamal, Elenbaas, Gage, Phung, Lam, Brakora, Karl, Dunne, Bruce E., Keenlance, Paul

المصدر: 2024 IEEE International Conference on Electro Information Technology (eIT) Electro Information Technology (eIT), 2024 IEEE International Conference on. :209-214 May, 2024

Relation: 2024 IEEE International Conference on Electro Information Technology (eIT)