المؤلفون: Jong-Bo Shim, Eun-Chul Ahn, Tae-Je Cho, Ho-Jung Moon, Tae-Gyeong Chung, Ju-Hyun Lyu, Hung-Kyu Kwon, Su-Yoon Kang, Se-Yong Oh

المصدر: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on. :201-205 2000

Relation: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

المؤلفون: Young-Lyong Kim, Cheul-Joong Youn, Jong-Ho Lee, Hyung-Kil Baek, Eun-Chul Ahn, Young-Hee Song, Tae-Gyeong Chung

المصدر: 2008 IEEE 9th VLSI Packaging Workshop of Japan VLSI Packaging Workshop of Japan, 2008. VPWJ 2008. IEEE 9th. :57-61 Dec, 2008

Relation: 2008 IEEE 9th VLSI Packaging Workshop of Japan

المؤلفون: Pyoung-Wan Kim, Bo-Seong Kim, Eun-Chul Ahn, Tae-Gyeong Chung

المصدر: 2006 8th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2006. EPTC '06. 8th. :168-173 Dec, 2006

Relation: 2006 8th Electronics Packaging Technology Conference

المؤلفون: Jin Yu, Young Ho Kim, Tae-Gyeong Chung

المصدر: Journal of Adhesion Science and Technology. 8:41-51

مصطلحات موضوعية: Auger electron spectroscopy, Materials science, genetic structures, Analytical chemistry, chemistry.chemical_element, Surfaces and Interfaces, General Chemistry, Adhesion, Sputter deposition, Polyethylene, Copper, Surfaces, Coatings and Films, Auger, chemistry.chemical_compound, chemistry, Mechanics of Materials, Materials Chemistry, Composite material, Thin film, Polyimide

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f1d231d02b1509c2b5321be3f66b96a0
https://doi.org/10.1163/156856194x00041

المؤلفون: Jongjoo Lee, Taejoo Hwang, Sungho Mun, Soonyong Hur, Tae-Gyeong Chung, Younghee Song

المصدر: 2007 Proceedings 57th Electronic Components and Technology Conference.

مصطلحات موضوعية: Thermal copper pillar bump, Interconnection, Engineering, Hardware_MEMORYSTRUCTURES, business.industry, Hardware_PERFORMANCEANDRELIABILITY, Chip, Printed circuit board, Plating, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Optoelectronics, Bumping, business, Dram, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::13eb9a0779d463a12f5d63c6e8055bc3
https://doi.org/10.1109/ectc.2007.373817

المؤلفون: Tae-Gyeong Chung, Hyeon Hwang, Teak-Hoon Lee, Jianhua Li, Myeongkee Chung, Qiang Chen, Pyoung-Wan Kim, Eun-Chul Ahn

المصدر: 2007 Proceedings 57th Electronic Components and Technology Conference.

مصطلحات موضوعية: Wire bonding, Laser ablation, Materials science, business.product_category, Residual stress, Etching (microfabrication), Laser beam machining, Die (manufacturing), Wafer dicing, Wafer, Composite material, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::247f5fe3fbe8ab171dcc9e708d3a5515
https://doi.org/10.1109/ectc.2007.373883

المؤلفون: Tae-Gyeong Chung, Hae-Hyung Lee, Joong-hyun Baek, Hee-Jin Lee, Se-Yong Oh

المصدر: Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium.

مصطلحات موضوعية: Air cooling, Engineering, Memory management, Memory module, business.industry, Electrical engineering, Electronics, Energy consumption, Heat sink, business, Automotive engineering, Fin (extended surface), Power (physics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0581b9231b7d494a5a822d4cea1b0bbf
https://doi.org/10.1109/stherm.2006.1625231

المؤلفون: Tae-Gyeong Chung, Pyoung-Wan Kim, Eun-Chul Ahn, Bo-Seong Kim

المصدر: 2006 8th Electronics Packaging Technology Conference.

مصطلحات موضوعية: Impact testing, Materials science, Drop (liquid), Soldering, Electronic packaging, Solderability, Solder ball, Impact test, Composite material, Drop test

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5bff488acb8a82fac609d8c6b37dacf5
https://doi.org/10.1109/eptc.2006.342710

المؤلفون: Min-Ha Kim, Joong-hyun Baek, Tae-Gyeong Chung, Seunghee Oh

المصدر: Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306).

مصطلحات موضوعية: Measurement method, Materials science, business.industry, Thermal resistance, Ball grid array, Thermal, Electrical engineering, Dice, Test method, Integrated circuit packaging, Composite material, business, Die (integrated circuit)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::07650cb782d0813a411e3b0d022bc401
https://doi.org/10.1109/stherm.1999.762441

المؤلفون: Ho-Jung Moon, Ju-Hyun Lyu, Tae-Je Cho, Eun-Chul Ahn, Jong-Bo Shim, Se-Yong Oh, Hung-Kyu Kwon, Su-Yoon Kang, Tae-Gyeong Chung

المصدر: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

مصطلحات موضوعية: Cracking, Substrate (building), Materials science, Passivation, Delamination, Temperature cycling, Composite material, Fillet (mechanics), Die (integrated circuit), Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7bab606cf86df4a579e02dfcd4bd66e5
https://doi.org/10.1109/isapm.2000.869270