يعرض 1 - 7 نتائج من 7 نتيجة بحث عن '"Tai, Takahiro"', وقت الاستعلام: 0.85s تنقيح النتائج
  1. 1
    مؤتمر
    Development of Glass core substrate with the stress analysis, transmission characteristics and reliability

    المؤلفون: Fujimoto, Koji, Okawa, Yashuhiro, Tai, Takahiro, Kuramochi, Satoru

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :546-550 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    High Speed Transmission Characteristics on Glass Based Interposers

    المؤلفون: Kuramochi, Satoru, Tanaka, Masaya, Tai, Takahiro

    المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-6 Sep, 2023

    Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

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  3. 3
    مؤتمر
    Panel-Based Large-Scale RDL Interposer Fabricated Using 2-μm-Pitch Semi-Additive Process for Chiplet-Based Integration

    المؤلفون: Kudo, Hiroshi, Takano, Takamasa, Tanaka, Masaya, Mawatari, Hiroshi, Kitayama, Daisuke, Tai, Takahiro, Tsunoda, Tsuyoshi, Kuramochi, Satoru

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :836-844 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    High-speed, High-density, and Highly-manufacturable Cu-filled Through-Glass-Via Channel (Cu bridge) for Multi-chiplet Systems

    المؤلفون: Kudo, Hiroshi, Takano, Takamasa, Akazawa, Miyuki, Yamada, Shouhei, Sakamoto, Kouji, Kitayama, Daisuke, Iida, Haruo, Tanaka, Masaya, Tai, Takahiro

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1031-1037 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Effectiveness of Inorganic Dielectric Layer on Submicron-scale Cu Traces against Thermal Oxidative Stress

    المؤلفون: Kudo, Hiroshi, Takano, Takamasa, Sakamoto, Kouji, Kitayama, Daisuke, Iida, Haruo, Tanaka, Masaya, Tai, Takahiro, Okazaki, Yumi, Suzuki, Jyunya, Maekawa, Shinji

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :353-358 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    High Frequency Characteristics of Glass Interposer

    المؤلفون: Tanaka, Masaya, Kuramochi, Satoru, Tai, Takahiro, Sato, Yoichiro, Kidera, Nobutaka

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :601-610 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  7. 7
    دورية
    Lead Zirconate Titanate Acoustic Energy Harvester Proposed for Microelectromechanical System/IC Integrated Systems

    المؤلفون: Shinoda, Shigeki, Tai, Takahiro, Itoh, Hisanori, Sugou, Tomohisa, Ichioka, Hirohide, Kimura, Shu, Nishioka, Yasushiro

    المصدر: Japanese Journal of Applied Physics; April 2010, Vol. 49 Issue: 4 p04DL21-04DL25, 5p

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