يعرض 1 - 10 نتائج من 39 نتيجة بحث عن '"Takiar, Hem"', وقت الاستعلام: 0.89s تنقيح النتائج
  1. 1
    مؤتمر
    Solder Joint Reliability Assessment on FO-CSP for Next Generation DDR6

    المؤلفون: Liu, Vance, Chen, Jian-Ming, Pan, Ji-An, Sinha, Koustav, Gan, CL, Yoo, Chan, Takiar, Hem

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :969-972 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  2. 2
    مؤتمر
    Fault Isolation for Board-Level Solder Joint Failure Using Time-Domain Reflectometry

    المؤلفون: Chen, Y. Y., Liu, W. J., Zou, Y. S., Chung, M. H., Gan, C. L., Takiar, Hem

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :795-798 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  3. 3
    مؤتمر
    Modified Multipoint Constraints of Finite Element Model for SJR Prediction Accuracy

    المؤلفون: Ting-Wen, Chen, Bin Bakhtiar, Muhammad Zulfadhli, Shin-Yueh, Yang, Yeow Chon, Ong, Glancey, Christopher, Takiar, Hem

    المصدر: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) Electronics Manufacturing Technology Conference (IEMT), 2022 IEEE 39th International. :1-5 Oct, 2022

    Relation: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)

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  4. 4
    مؤتمر
    Temperature Cycling Performance of Bi-doped Solder Ball Alloy on DRAM Module Form and Daisy-Chained Printed Circuit Board

    المؤلفون: Zou, Y. S., Chung, M. H., Gan, C. L., Chen, Jeremy, Hsu, Claire, Takiar, Hem

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :567-569 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  5. 5
    مؤتمر
    Effects of Sb and Bi addition on IMC morphology and reliability of Pb-free solder/Cu-OSP

    المؤلفون: Zou, Y. S., Chung, M. H., Gan, C. L., Hsu, Yun Ting, Takiar, Hem

    المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :419-422 Dec, 2021

    Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

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  6. 6
    مؤتمر
    Low Temperature Solder Paste Characterization for Memory Module and SSD Product Level Reliability Tests

    المؤلفون: Chen, C. M., Gan, C. L., Wilson, Kal, Tennant, Tracy, Du, Henry, Wong, Kok Wai, Ang, Xue Yong, Takiar, Hem

    المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :423-426 Dec, 2021

    Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

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  7. 7
    مؤتمر
    Mechanical Suite of Flexural Bending Method for Electronic Memory Packages

    المؤلفون: Liu, Vance, Arifeen, Shams, Bassett, Cassie, Chung, Min, Gan, CL, Takiar, Hem

    المصدر: 2021 IEEE International Conference on Sensors and Nanotechnology (SENNANO) Sensors and Nanotechnology (SENNANO), 2021 IEEE International Conference on. :45-49 Sep, 2021

    Relation: 2021 IEEE International Conference on Sensors and Nanotechnology (SENNANO)

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  8. 8
    مؤتمر
    Comparative Study of Solder Strength Characterization for BGA Packages

    المؤلفون: Liu, Vance, Lai, Show, Zou, Mason, Chen, Jeremy, Gan, Cl, Takiar, Hem

    المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :427-429 Dec, 2021

    Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

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  9. 9
    مؤتمر
    Predictive Solder Joint Reliability Modeling for Early Risk Assessment

    المؤلفون: Sinha, Koustav, Glancey, Christopher, Takiar, Hem, Ong, Yeow Chon, Pan, Ling

    المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :330-334 Dec, 2020

    Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

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  10. 10
    مؤتمر
    Investigation of Shear Strength and Temperature Cycling Performance of Bi-doped Sn-Ag-Cu Solder Joints

    المؤلفون: Zou, Y. S., Chung, M. H., Tennant, Tracy, Gan, C. L., Hsu, Yun Ting, Takiar, Hem

    المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :286-290 Dec, 2020

    Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

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