المؤلفون: Isobe, A., Kamada, Y., Takubo, C., Furubayashi, Y., Oshima, T., Sakuma, N., Sekiguchi, T.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 20(3):1184-1190 Feb, 2020

المؤلفون: Kamada, Y., Isobe, A., Oshima, T., Furubayashi, Y., Sakuma, N., Takubo, C., Tainaka, Y., Watanabe, K., Mori, K., Mori, N., Kazama, H., Matsumoto, A., Sekiguchi, T.

المصدر: 2018 IEEE Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2018 IEEE. :936-939 Jan, 2018

Relation: 2018 IEEE Micro Electro Mechanical Systems (MEMS)

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المؤلفون: Maeda, D., Jeong, H., Takubo, C., Degawa, M., Yamanaka, K., Shoji, M., Goto, Y.

المصدر: 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International. :44-47 Jun, 2011

Relation: TRANSDUCERS 2011 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

المؤلفون: Mochizuki, K., Tanaka, K., Takubo, C., Matsumoto, H., Tanoue, T., Ohbu, I.

المصدر: 2003 International Symposium on Compound Semiconductors: Post-Conference Proceedings (IEEE Cat. No.03TH8767) Compound semiconductors Compound Semiconductors: Post-Conference Proceedings, 2003 International Symposium on. :118-123 2003

Relation: 2003 International Symposium on Compound Semiconductors: Post-Conference Proceedings

المؤلفون: Tanaka, K., Mochizuki, K., Takubo, C., Matsumoto, H., Tanoue, T., Ohbu, I.

المصدر: IEEE MTT-S International Microwave Symposium Digest, 2003 Microwave symposium digest Microwave Symposium Digest, 2003 IEEE MTT-S International. 3:2197-2200 vol.3 2003

Relation: IEEE MTT-S International Microwave Symposium - IMS 2003

المؤلفون: Imoto, T., Matsui, M., Takubo, C., Akejima, S., Kariya, T., Nishikawa, T., Enomoto, R.

المصدر: 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Electronic components and technology Electronic Components and Technology Conference, 2001. Proceedings., 51st. :552-557 2001

Relation: 51st Electronic Components and Technology Conference 2001. Proceedings

المؤلفون: Matsuo, M., Hayasaka, N., Okumura, K., Hosomi, E., Takubo, C.

المصدر: 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Electronic components and technology Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th. :1455-1459 2000

Relation: 2000 Proceedings. 50th Electronic Components and Technology Conference

المؤلفون: Takubo, C., Hikita, M., Asai, K.

المصدر: 1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027) Ultrasonics Ultrasonics Symposium, 1999. Proceedings. 1999 IEEE. 1:369-372 vol.1 1999

Relation: 1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium

المؤلفون: Hirohata, K., Hisano, K., Mukai, M., Aoki, H., Takubo, C., Kawakami, T., Pecht, M. G.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 33(2):347-358 Jun, 2010