-
1مؤتمر
المؤلفون: Kazuo Matsukawa, Takashi Morie, Yusuke Tokunaga, Shiro Sakiyama, Yosuke Mitani, Masao Takayama, Takuji Miki, Akinori Matsumoto, Koji Obata, Shiro Dosho
المصدر: 2009 Asia and South Pacific Design Automation Conference Design Automation Conference, 2009. ASP-DAC 2009. Asia and South Pacific. :690-695 Jan, 2009
Relation: 2009 Asia and South Pacific Design Automation Conference (ASP-DAC)
-
2
المؤلفون: Futaya, Tokio, Mizokuchi, Raisei, Taguchi, Misato, Takuji, Miki, Nagata, Makoto, Yoneda, Jun, Kodera, Tetsuo
URL الوصول: https://explore.openaire.eu/search/publication?articleId=jairo_______::024186c17ce53e6f996fe923074dfd94
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100891287 -
3
المؤلفون: Makoto Nagata, Noriyuki Miura, Takuji Miki
المصدر: IEEE Solid-State Circuits Magazine. 15:25-31
مصطلحات موضوعية: Electrical and Electronic Engineering
-
4
المؤلفون: Hiroki Sonoda, Ryo Kasai, Daisuke Tanaka, Yoshihide Murakami, Kyoshi Mihara, Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi, Takuji Miki, Makoto Nagata
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1140-1149
مصطلحات موضوعية: power delivery network (PDN), power noise, low-voltage differential signaling (LVDS), Si capacitor (SiCap), signal integrity, power integrity, multichip module, Fan-out (FO) packaging, Electrical and Electronic Engineering, on chip monitoring, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials
وصف الملف: application/pdf
-
5
المؤلفون: Yuya Aoki, Tatsuya Iwata, Takuji Miki, Kazutoshi Kobayashi, Takefumi Yoshikawa
المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8b5ede74e45dc99ea1849a0b20584d83
https://doi.org/10.1109/irps48203.2023.10118123 -
6
المؤلفون: Ryozo TAKAHASHI, Takuji MIKI, Makoto NAGATA
المصدر: IEICE Transactions on Electronics.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5aec615924720a6e63b444637bedff9b
https://doi.org/10.1587/transele.2022cts0002 -
7
المؤلفون: Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa, Kikuo Muramatsu, Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo, Takuji Miki, Makoto Nagata
المصدر: IEICE Transactions on Electronics.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6fad1289a640f490a9035e5c1d557890
https://doi.org/10.1587/transele.2022ctp0004 -
8
المؤلفون: Noriyuki Miura, Makoto Nagata, Takuji Miki
المصدر: IEEE Transactions On Very Large Scale Integration (VLSI) Systems. 30(1):5-14
مصطلحات موضوعية: Hardware security module, Silicon, Computer science, Design elements and principles, Cryptography, Integrated circuits, Integrated circuit, Hardware_PERFORMANCEANDRELIABILITY, law.invention, Backside metal wirings, Hardware, side-channel attack, Si substrate, laser fault injection attack, law, Hardware_INTEGRATEDCIRCUITS, Electrical and Electronic Engineering, power delivery network, Electronic circuit, electromagnetic (EM) attack, cryptography, Si substrate attack, Substrates, business.industry, Chip, CMOS, Hardware and Architecture, Embedded system, on-chip monitoring, Security, hardware security, business, Software, Hardware_LOGICDESIGN, System-on-chip
وصف الملف: application/pdf
-
9
المؤلفون: Kazuki Monta, Leonidas Katselas, Ferenc Fodor, Takuji Miki, Alkis Hatzopoulos, Makoto Nagata, Erik Jan Marinissen
المساهمون: Electronic Systems
المصدر: IEEE Design & Test, 39(5), 79-87. Institute of Electrical and Electronics Engineers
مصطلحات موضوعية: Hardware and Architecture, Electrical and Electronic Engineering, Software
وصف الملف: application/pdf
-
10
المؤلفون: Noriyuki Miura, Takaaki Okidono, Naoya Watanabe, Takuji Miki, Katsuya Kikuchi, Haruo Shimamoto, Makoto Nagata, Yuuki Araga, Hiroki Sonoda, Kazuki Monta
المصدر: IEEE Transactions on Electron Devices. 68:2077-2082
مصطلحات موضوعية: Cryptographic engine, Materials science, electromagnetic (EM) compatibility, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit, 01 natural sciences, Capacitance, Noise (electronics), law.invention, Stack (abstract data type), law, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, Electrical and Electronic Engineering, 010302 applied physics, business.industry, Chip, power signal integrity, Electronic, Optical and Magnetic Materials, power supply noise (PSN), Capacitor, CMOS, Si substrate backside, Optoelectronics, business, side channel leakage, on chip monitoring, Decoupling (electronics)
وصف الملف: application/pdf