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المؤلفون: Ushasree Katakamsetty, Stefan Voykov, Sascha Bott, Sam Nakagawa, Tamba Gbondo-Tugbawa, Aaron Gower-Hall, Brian Lee, Jansen Chee, Henry Geng, Weiyang Zhu, Bifeng Li, Kimiko Ichikawa
المصدر: DTCO and Computational Patterning.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fa0403ec439f4f9c2637c0ee6e7a789e
https://doi.org/10.1117/12.2616078 -
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المؤلفون: Single Hsu, Brian Lee, Jansen Chee, Tamba Gbondo-Tugbawa, Ethan Wang, Ya-Chieh Lai, Eason Lin, Aaron Gower-Hall
المصدر: Design-Process-Technology Co-optimization for Manufacturability XIV.
مصطلحات موضوعية: Back end of line, Interconnection, Hardware_MEMORYSTRUCTURES, Computer science, Chemical-mechanical planarization, Pooling, Process (computing), Copper interconnect, Early detection, Integrated circuit design, ComputerSystemsOrganization_PROCESSORARCHITECTURES, Computational science
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d21447ff09e2988bd3986fd3d34e4ad2
https://doi.org/10.1117/12.2551253 -
3
المؤلفون: Yang-Chih Chiu, Brian Lee, ZhengFang Liu, Tamba Gbondo-Tugbawa, Kuang Han Chen, Hua Ding, JinBing Liu, Aaron Gower-Hall, Flora Li, Helen Li, Chunlei Zhang
المصدر: SPIE Proceedings.
مصطلحات موضوعية: 0209 industrial biotechnology, Silicon, Semiconductor device fabrication, Computer science, Oxide, chemistry.chemical_element, 02 engineering and technology, Nitride, 01 natural sciences, law.invention, 010309 optics, chemistry.chemical_compound, Back end of line, 020901 industrial engineering & automation, law, Chemical-mechanical planarization, Shallow trench isolation, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Wafer, Transistor, Copper, Design for manufacturability, chemistry, Front end of line
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c0934e7080a3a24f524fc6c908b883ce
https://doi.org/10.1117/12.2219912 -
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المؤلفون: Eunjoo Choi, Sang Min Han, Tamba Gbondo-Tugbawa, Kuang Han Chen, Yongchan Ban
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Length scale, Interconnection, Flow (mathematics), Design flow, 0202 electrical engineering, electronic engineering, information engineering, Range (statistics), Extraction (military), 02 engineering and technology, Parallel computing, Timing closure, Algorithm, 020202 computer hardware & architecture, Design for manufacturability
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d28347671555860685751e3fd4e20b9e
https://doi.org/10.1117/12.2219118 -
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المؤلفون: Tamba Gbondo-Tugbawa, Ushasree Katakamsetty, Brian Lee, Kuang-Han Chen, Yongfu Li, Jaime Bravo, Aaron Gower-Hall, Sang Min Han, Jansen Chee, Colin Hui
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Hardware_MEMORYSTRUCTURES, Silicon, Semiconductor device fabrication, business.industry, Computer science, Real-time computing, chemistry.chemical_element, chemistry, Chemical-mechanical planarization, Hotspot (geology), Hardware_INTEGRATEDCIRCUITS, Microelectronics, Wafer, business, Process engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::153c0293f8e0cb85fc2e7965471f09aa
https://doi.org/10.1117/12.2219545 -
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المؤلفون: JenPin Weng, Toshiaki Yanagisawa, Aaron Gower-Hall, Stephen E. Greco, Tamba Gbondo-Tugbawa, Laertis Economikos, Pavan Y. Bashaboina, Wei-Tsu Tseng
المصدر: ISQED
مصطلحات موضوعية: Engineering drawing, Engineering, Hardware_MEMORYSTRUCTURES, business.industry, Design flow, Pooling, Copper interconnect, chemistry.chemical_element, Copper, Design for manufacturability, chemistry, Chemical-mechanical planarization, Hardware_INTEGRATEDCIRCUITS, Process optimization, Process engineering, business, Failure mode and effects analysis
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9d7541019bfb9b4b2e1b39126a01ee74
https://doi.org/10.1109/isqed.2012.6187496 -
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المؤلفون: Seung-Weon Paek, Aaron Gower-Hall, Jinwoo Lee, Kuang Han Chen, Tamba Gbondo-Tugbawa, Naya Ha, Philippe Hurat, Kee Sup Kim
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Computer science, Block level, Tape-out, Reliability engineering, Design for manufacturability
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e3db15527b2d254a1537b1e7599e4936
https://doi.org/10.1117/12.880899 -
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المؤلفون: Xian Bin Wang, Colin Hui, Subramanian Jayathi, Chi-Min Yuan, Laertis Economikos, Ushasree Katakamsetty, Xiang Hua, Tamba Gbondo-Tugbawa, Vikas Mehrotra, Kuang Han Chen, Song Li, Taber H. Smith, Mohammed Fazil Fayaz, Stephen E. Greco, Haigou Huang
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Chemical-mechanical planarization, Hardware_INTEGRATEDCIRCUITS, Copper interconnect, System on a chip, Process window, Rule-based system, Macro, Chip, Reliability engineering, Design for manufacturability
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::df7eefa136d5fede5b72d4191e8b8e20
https://doi.org/10.1117/12.816556