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1مؤتمر
المؤلفون: Chew, Carrie, Tan, Chip King
المصدر: 2006 International Conference on Electronic Materials and Packaging Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. :1-10 Dec, 2006
Relation: 2006 International Conference on Electronic Materials and Packaging
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2
المؤلفون: Tan Chip King
المصدر: 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
مصطلحات موضوعية: Materials science, JEDEC memory standards, Thermal resistance, visual_art, MOSFET, Delamination, visual_art.visual_art_medium, Epoxy, Integrated circuit packaging, Body size, Composite material, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::968fdd3c690914f0a0f50938f175bfce
https://doi.org/10.1109/iemt.2006.4456481
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3دورية
المؤلفون: Tan, Chip King, Zhang, YuJun, Juan, Shen, Haimerl, Alfred, Gisela, Wurdack
المصدر: ECS Transactions; November 2010, Vol. 27 Issue: 1
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