يعرض 1 - 10 نتائج من 1,479 نتيجة بحث عن '"Tan, Chuan"', وقت الاستعلام: 1.02s تنقيح النتائج
  1. 1
    مؤتمر
    Deep Reinforcement Learning-Based Power Distribution Network Design Optimization for Multi-Chiplet System

    المؤلفون: Miao, Weiyang, Xie, Zhen, Tan, Chuan Seng, Rotaru, Mihai D.

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1716-1723 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    CMOS-Fabricated Ring Surface Ion Trap with TSV Integration

    المؤلفون: Zhao, Peng, Lim, Yu Dian, Li, Hongyu, Likforman, Jean-Pierre, Guidoni, Luca, Desormeaux, Lilay Gros, Tan, Chuan Seng

    المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

    Relation: 2023 International Electron Devices Meeting (IEDM)

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  3. 3
    مؤتمر
    Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing

    المؤلفون: Kiat Goh, Simon Chun, Hemanth Kumar, Cheemalamarri, Hu, Liangxing, Shervonne, Woon, Jaafar, Norhanani, Khoon Sherry, Yap Lee, Huang, Ding, Lau, Chit Siong, Kumar Karuppannan, Senthil, Li, Hongyu, Tan, Chuan Seng, Chui, King-Jien

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :404-408 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  4. 4
    مؤتمر
    Copper wire degradation under the effect of different humidity levels

    المؤلفون: Zhong Lim, Michael Joo, Loh, Hai Guan, Goroll, Michael, Chen, Zhong, Tan, Chuan Seng

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1095-1099 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Eye Diagram Analysis with Deep Neural Networks for Signal Integrity Applications

    المؤلفون: Weiyang, Miao, Tan, Chuan Seng, Rotaru, Mihai D.

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :212-217 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  6. 6
    مؤتمر
    Comparative Study of Die-Attach Materials for LED Die Bonding

    المؤلفون: Hu, Liangxing, Bao, Shuyu, Wang, Yue, Kiat Goh, Simon Chun, Lim, Yu Dian, Zhao, Peng, Lim, Michael Joo Zhong, Miao, Weiyang, Dinh, Van Quy, Tan, Sai Choo, Chew, Kai Hwa, Tan, Chuan Seng

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :447-451 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  7. 7
    مؤتمر
    Tuning indirect-to-direct bandgap of lonsdaleite Si0.5Ge0.5 alloy via compressive strain for optical gain

    المؤلفون: Mayengbam, Rishikanta, Das, Subhasis, Tan, Chuan Seng, Fan, Weijun

    المصدر: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2023 7th IEEE. :1-3 Mar, 2023

    Relation: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

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  8. 8
    مؤتمر
    Plasma-Activated Cu-Cu and Al-Al Direct Bonding for Electronics Packaging

    المؤلفون: Hu, Liangxing, Goh, Simon Chun Kiat, Lim, Yu Dian, Zhao, Peng, Lim, Michael Joo Zhong, Miao, Weiyang, Dinh, Van Quy, Tan, Chuan Seng

    المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

    Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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  9. 9
    مؤتمر
    Ceramic Pin Grid Array with Built-in Interconnects to Locate TSV Integrated Ion Trap for Wire Bonding-free Assembly

    المؤلفون: Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Hu, Liang Xing, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng

    المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :1-5 Sep, 2022

    Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

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  10. 10
    تقرير
    BIM-to-BRICK: Using graph modeling for IoT/BMS and spatial semantic data interoperability within digital data models of buildings

    المؤلفون: Vittori, Filippo, Tan, Chuan Fu, Pisello, Anna Laura, Chong, Adrian, Miller, Clayton

    مصطلحات موضوعية: Electrical Engineering and Systems Science - Systems and Control

    URL الوصول: http://arxiv.org/abs/2307.13197

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