المؤلفون: Xiong, Zishan, Zhao, Xiuchen, Yu, Jiexun, Qiao, Pengyi, Wei, Yuhang, Tan, Chengwen

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Feng, Na^{Aff1, Aff2, IDs1033802300413z_cor1}, Li, Mingrui, Ma, Kun, Chen, Chunlin, Yin, Lixin, Zhou, Gang, Tan, Chengwen

المصدر: Acta Mechanica Solida Sinica: The Chinese Society of Theoretical and Applied Mechanics. 36(5):702-709

المؤلفون: Liu, Guanqi, Yan, Ziyu, Guo, Yuzhu, Guo, Chuanbin, Tan, Chengwen, Zhu, Jianhua, Han, Jianmin

المصدر: In Heliyon 15 May 2024 10(9)

المؤلفون: Liu, Guanqi, Wang, Kai, Pan, Yiyang, Yang, Di, Yu, Xiaodong, Nie, Zhihua, Zhu, Jianhua, Han, Jianmin, Tan, Chengwen

المصدر: In Journal of Materials Research and Technology May-June 2024 30:5916-5926

المؤلفون: Jin, Xueyi, Nie, Zhihua^{Aff1, IDs1085302308447x_cor2}, Xu, Chi, Yu, Xiaodong, Tan, Chengwen

المصدر: Journal of Materials Science. 58(17):7493-7503

المؤلفون: Ji, Renyi, Nie, Zhihua, Yu, Xiaodong, Xie, Qingge, Li, Xun, Tan, Chengwen

المصدر: In International Journal of Refractory Metals and Hard Materials August 2024 122

المؤلفون: Liua, Yingxia, Pu, Li, Yang, Yong, He, Quanfeng, Zhou, Ziqing, Tan, Chengwen, Zhao, Xiuchen, Zhang, Qingshan, Tu, K. N.

مصطلحات موضوعية: Physics - Applied Physics, Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/2006.01345

المؤلفون: Feng, Na, Ma, Kun, Chen, Chunlin, Yin, Lixin, Li, Mingrui, Nie, Zhihua, Zhou, Gang, Tan, Chengwen

المصدر: In Defence Technology October 2023 28:314-329

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المؤلفون: Liu, Guanqi, Han, Jianmin, Li, Ying, Guo, Yuzhu, Yu, Xiaodong, Yuan, Shenpo, Nie, Zhihua, Tan, Chengwen, Guo, Chuanbin

المصدر: In Journal of Magnesium and Alloys July 2023 11(7):2429-2441