المؤلفون: Tan, K. H.^{Aff1, Aff2, IDs11829023099874_cor1}, Ong, P. T., Tan, L. T.

المصدر: Arthropod-Plant Interactions: An international journal devoted to studies on interactions of insects, mites, and other arthropods with plants. 17(5):647-660

المؤلفون: Goh, S. M.^{Aff1, IDs4086402200172z_cor1}, Tan, L. T., Gan, H. Y., Foo, Y. L., Goh, K. H., Lee, H. S.

المصدر: Urban Rail Transit. 8(3-4):184-197

المؤلفون: Tan, L. T., Liew, C. H., Nazakat, Akeel, Tan, Jethro, Kho, W.F.

المصدر: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2016 IEEE 23rd International Symposium on the. :404-407 Jul, 2016

Relation: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Tan, L. T.^Aff12, Goh, S. M.^Aff12, Gan, H. Y.^Aff12, Foo, Y. L.^Aff12

المساهمون: Cavas-Martínez, Francisco, Series Editor^Aff1, Chaari, Fakher, Series Editor^Aff2, Gherardini, Francesco, Series Editor^Aff3, Haddar, Mohamed, Series Editor^Aff4, Ivanov, Vitalii, Series Editor^Aff5, Kwon, Young W., Series Editor^Aff6, Trojanowska, Justyna, Series Editor^Aff7, Gelman, Len, editor^Aff8, Martin, Nadine, editor^Aff9, Malcolm, Andrew A., editor^Aff10, (Edmund) Liew, Chin Kian, editor^Aff11

المصدر: Advances in Condition Monitoring and Structural Health Monitoring : WCCM 2019. :537-548

المؤلفون: Tan, L. T., Le, L. B.

المصدر: IEEE Transactions on Vehicular Technology IEEE Trans. Veh. Technol. Vehicular Technology, IEEE Transactions on. 61(6):2808-2823 Jul, 2012

المؤلفون: Tan, L. T., Le, L. B.

المصدر: IEEE Transactions on Vehicular Technology IEEE Trans. Veh. Technol. Vehicular Technology, IEEE Transactions on. 60(8):3990-4003 Oct, 2011

المؤلفون: Schulz, S., Caro, M. A., Tan, L. -T., Parbrook, P. J., Martin, R. W., O'Reilly, E. P.

مصطلحات موضوعية: Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/1310.3947

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المؤلفون: Foong B. C. M., Ho S. W. L., Tan L. T. J., Lee K. T., Jegathesan T.

المصدر: Malaysian Orthopaedic Journal; Jul2023, Vol. 17 Issue 2, p43-48, 6p

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