المؤلفون: Sell, B., An, S., Armstrong, J., Bahr, D., Bains, B., Bambery, R., Bang, K., Basu, D., Bendapudi, S., Bergstrom, D., Bhandavat, R., Bhowmick, S., Buehler, M., Caselli, D., Cekli, S., Chaganti, Vrsk., Chang, Y. J., Chikkadi, K., Chu, T., Crimmins, T., Darby, G., Ege, C., Elfick, P., Elko-Hansen, T., Fang, S., Gaddam, C., Ghoneim, M., Gomez, H., Govindaraju, S., Guo, Z., Hafez, W., Haran, M., Hattendorf, M., Hu, S., Jain, A., Jaloviar, S., Jang, M., Kameswaran, J., Kapinus, V., Kennedy, A., Klopcic, S., Krishnan, D., Leib, J., Lin, Y.-T., Lindert, N., Liu, G., Loh, O., Luo, Y., Mani, S., Mleczko, M., Mocherla, S., Packan, P., Paik, M., Paliwal, A., Pandey, R., Patankar, K., Pipes, L., Plekhanov, P., Prasad, C., Prince, M., Ramalingam, G., Ramaswamy, R., Riley, J., Perez, J. R. Sanchez, Sandford, J., Sathe, A., Shah, F., Shim, H., Subramanian, S., Tandon, S., Tanniru, M., Thakurta, D., Troeger, T., Wang, X., Ward, C., Welsh, A., Wickramaratne, S., Wnuk, J., Xu, S. Q., Yashar, P., Yaung, J., Yoon, K., Young, N.

المصدر: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2022 IEEE Symposium on. :282-283 Jun, 2022

Relation: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

المؤلفون: Yeoh, A., Madhavan, A., Kybert, N., Anand, S., Shin, J., Asoro, M., Samarajeewa, S., Steigerwald, J., Ganpule, C., Buehler, M., Tripathi, A., Souw, V., Haran, M., Nigam, S., Chikarmane, V., Yashar, P., Mule, T., Wu, Y-H., Lee, K-S., Aykol, M., Marla, K., Sinha, P., Kirby, S., Hiramatsu, H., Han, W., Mori, M., Sharma, M., Jeedigunta, H., Sprinkle, M., Pelto, C., Tanniru, M., Leatherman, G., Fischer, K., Post, I., Auth, C.

المصدر: 2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :144-147 Jun, 2018

Relation: 2018 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Agarwal, R., Tanniru, M.

المصدر: Proceedings of the Twenty-Fourth Annual Hawaii International Conference on System Sciences System Sciences, 1991. Proceedings of the Twenty-Fourth Annual Hawaii International Conference on. iii:250-258 vol.3 1991

Relation: Proceedings of the Twenty-Fourth Annual Hawaii International Conference on System Sciences

المؤلفون: Agarwal, R., Tanniru, M., Wilemon, D.

المصدر: IEEE Transactions on Engineering Management IEEE Trans. Eng. Manage. Engineering Management, IEEE Transactions on. 44(4):347-358 Nov, 1997

المؤلفون: Zhao, J.L., Brown, G.W., Carey, M.J., Kumar, A., Spohrer, J.C., Tanniru, M.

المصدر: 2005 IEEE International Conference on Services Computing (SCC'05) Vol-1 Services computing Services Computing, 2005 IEEE International Conference on. 1:xxv-xxvi 2005

Relation: 2005 IEEE International Conference on Services Computing

المؤلفون: Yiwen Zhang, Tanniru, M.

المصدر: Proceedings of the 38th Annual Hawaii International Conference on System Sciences System Sciences, 2005. HICSS '05. Proceedings of the 38th Annual Hawaii International Conference on. :11c-11c 2005

Relation: Proceedings of the 38th Annual Hawaii International Conference on System Sciences

المؤلفون: Gil, D., Johnsson, Magnus, Szymanski, J., Peral, J., Tanniru, M.

المصدر: Research and Innovation Forum 2021 Springer Proceedings in Complexity. :133-140

مصطلحات موضوعية: Autism Spectrum Disorder, Data mining, Machine learning

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:mau:diva-48623
https://link.springer.com/chapter/10.1007/978-3-030-84311-3_13

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المؤلفون: Tanniru, M., Yuan, Q., Misra, R.D.K

المصدر: In Polymer 2006 47(6):2133-2146

المؤلفون: SHRINIWASAN, S, TIEN, HY, TANNIRU, M, TATIPARTI, SSV

المصدر: IndraStra Global.

مصطلحات موضوعية: Kinetic parameter, Interfacial, JMAK, MAGNESIUM, Diffusional, Growth dimensionality, HYDROGENATION, KINETICS, NUCLEATION

URL الوصول: https://explore.openaire.eu/search/publication?articleId=issn23813652::0401af34cf1b9006dfc31cce286b317d
http://dspace.library.iitb.ac.in/xmlui/handle/100/23149