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1مؤتمر
المؤلفون: Guo, Mengyuan, Mo, Zhiwen, Wang, Qin, Jiang, Jianfei, Sheng, Weiguang, Jing, Naifeng
المصدر: 2021 IEEE 2nd International Conference on Information Technology, Big Data and Artificial Intelligence (ICIBA) Information Technology, Big Data and Artificial Intelligence (ICIBA), 2021 IEEE 2nd International Conference on. 2:766-771 Dec, 2021
Relation: 2021 IEEE 2nd International Conference on Information Technology, Big Data and Artificial Intelligence (ICIBA)
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2مؤتمر
المؤلفون: Kabir, MD Arafat, Peng, Yarui
المصدر: 2020 IEEE 33rd International System-on-Chip Conference (SOCC) System-on-Chip Conference (SOCC), 2020 IEEE 33rd International. :277-282 Sep, 2020
Relation: 2020 IEEE 33rd International System-on-Chip Conference (SOCC)
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3مؤتمر
المؤلفون: Wang, Chien-Cheng, Tseng, Kai-Ting, Chuang, Chia-Jui, Richard, Chen, S.J., Piao, Yu-Hang
المصدر: 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2019 30th Annual SEMI. :1-4 May, 2019
Relation: 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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4مؤتمر
المؤلفون: Yuan, Qiao, Zhu, Jinyu, Zou, Guangnan, Li, Biao, Shao, Yangzhou, Wang, Jie
المصدر: 2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) Electron Devices and Solid-State Circuits (EDSSC), 2019 IEEE International Conference on. :1-3 Jun, 2019
Relation: 2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)
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5كتاب إلكتروني
المؤلفون: Xu, JianAff2
المساهمون: Li, Suny, editorAff1
المصدر: MicroSystem Based on SiP Technology. :737-757
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6كتاب إلكتروني
المؤلفون: Fitzgerald, Alissa M.Aff6, White, Carolyn D.Aff6, Chung, Charles C.Aff7
المساهمون: Howe, Roger T., Series EditorAff1, Ricco, Antonio J., Series EditorAff2, Fitzgerald, Alissa M.Aff3, White, Carolyn D.Aff4, Chung, Charles C.Aff5
المصدر: MEMS Product Development : From Concept to Commercialization. :129-148
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7
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8
المؤلفون: Joydeep Basu
المصدر: IETE Journal of Education. 60:51-64
مصطلحات موضوعية: Signal Processing (eess.SP), 010302 applied physics, Very-large-scale integration, Materials science, business.industry, Semiconductor device fabrication, 020208 electrical & electronic engineering, 02 engineering and technology, Integrated circuit, 01 natural sciences, law.invention, Dome (geology), Semiconductor, CMOS, law, 0103 physical sciences, FOS: Electrical engineering, electronic engineering, information engineering, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Electronics, Electrical Engineering and Systems Science - Signal Processing, Tape-out, business
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9دورية أكاديمية
المؤلفون: Chien, Chen-Fu, Wu, Jei-Zheng, Wu, Chien-Cheng
المصدر: Flexible Services and Manufacturing Journal. September 2013 25(3):286-309
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10
المؤلفون: Tallha Akram, Sajjad Ali Haider, Zaheer Tabassam, Musaed Alhussein, Syed Rameez Naqvi, Khursheed Aurangzeb
المصدر: IEEE Access, Vol 7, Pp 33978-34003 (2019)
مصطلحات موضوعية: Very-large-scale integration, General Computer Science, Handshake, business.industry, Computer science, Pipeline (computing), 020208 electrical & electronic engineering, Design flow, General Engineering, 020206 networking & telecommunications, 02 engineering and technology, Asynchronous logic, Automation, electronic design and automation, Computer architecture, Asynchronous communication, Robustness (computer science), 0202 electrical engineering, electronic engineering, information engineering, microprocessor, General Materials Science, lcsh:Electrical engineering. Electronics. Nuclear engineering, Tape-out, business, lcsh:TK1-9971, Asynchronous circuit