يعرض 1 - 10 نتائج من 278 نتيجة بحث عن '"Tape-out"', وقت الاستعلام: 0.93s تنقيح النتائج
  1. 1
    مؤتمر
    Accelerator for Sparse Convolutional Neural Networks Based on Shift Units

    المؤلفون: Guo, Mengyuan, Mo, Zhiwen, Wang, Qin, Jiang, Jianfei, Sheng, Weiguang, Jing, Naifeng

    المصدر: 2021 IEEE 2nd International Conference on Information Technology, Big Data and Artificial Intelligence (ICIBA) Information Technology, Big Data and Artificial Intelligence (ICIBA), 2021 IEEE 2nd International Conference on. 2:766-771 Dec, 2021

    Relation: 2021 IEEE 2nd International Conference on Information Technology, Big Data and Artificial Intelligence (ICIBA)

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  2. 2
    مؤتمر
    Holistic 2.5D Chiplet Design Flow: A 65nm Shared-Block Microcontroller Case Study

    المؤلفون: Kabir, MD Arafat, Peng, Yarui

    المصدر: 2020 IEEE 33rd International System-on-Chip Conference (SOCC) System-on-Chip Conference (SOCC), 2020 IEEE 33rd International. :277-282 Sep, 2020

    Relation: 2020 IEEE 33rd International System-on-Chip Conference (SOCC)

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  3. 3
    مؤتمر
    The study on critical dimension target prediction for etch process : IE: Industrial Engineering

    المؤلفون: Wang, Chien-Cheng, Tseng, Kai-Ting, Chuang, Chia-Jui, Richard, Chen, S.J., Piao, Yu-Hang

    المصدر: 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2019 30th Annual SEMI. :1-4 May, 2019

    Relation: 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

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  4. 4
    مؤتمر
    A Ku Broadband Low Noise Amplifier for New Generation Satellite Communication System

    المؤلفون: Yuan, Qiao, Zhu, Jinyu, Zou, Guangnan, Li, Biao, Shao, Yangzhou, Wang, Jie

    المصدر: 2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) Electron Devices and Solid-State Circuits (EDSSC), 2019 IEEE International Conference on. :1-3 Jun, 2019

    Relation: 2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)

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  5. 5
    كتاب إلكتروني
    2.5D TSV Technology and Design Case

    المؤلفون: Xu, JianAff2

    المساهمون: Li, Suny, editorAff1

    المصدر: MicroSystem Based on SiP Technology. :737-757

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  6. 6
    كتاب إلكتروني
    Design for Manufacturing: Process Integration and Photomask Layout

    المؤلفون: Fitzgerald, Alissa M.Aff6, White, Carolyn D.Aff6, Chung, Charles C.Aff7

    المساهمون: Howe, Roger T., Series EditorAff1, Ricco, Antonio J., Series EditorAff2, Fitzgerald, Alissa M.Aff3, White, Carolyn D.Aff4, Chung, Charles C.Aff5

    المصدر: MEMS Product Development : From Concept to Commercialization. :129-148

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  7. 7
    Ultra-Low-Power Inter-Integrated Circuit Implementation for Fabric-Based Self-Powered Systems

    مصطلحات موضوعية: Communication-Protocol, I2C, Ultra-Low-Power, Tape-out, SoC

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fad5b91b8b11525ec7f9afe8bce67ef6

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  8. 8
    From Design to Tape-out in SCL 180 nm CMOS Integrated Circuit Fabrication Technology

    المؤلفون: Joydeep Basu

    المصدر: IETE Journal of Education. 60:51-64

    مصطلحات موضوعية: Signal Processing (eess.SP), 010302 applied physics, Very-large-scale integration, Materials science, business.industry, Semiconductor device fabrication, 020208 electrical & electronic engineering, 02 engineering and technology, Integrated circuit, 01 natural sciences, law.invention, Dome (geology), Semiconductor, CMOS, law, 0103 physical sciences, FOS: Electrical engineering, electronic engineering, information engineering, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Electronics, Electrical Engineering and Systems Science - Signal Processing, Tape-out, business

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::02b2ec610049509626f632dcc010cba3
    https://doi.org/10.1080/09747338.2019.1657787

    PDF full text from Publisher
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  9. 9
    دورية أكاديمية
    A two-stage stochastic programming approach for new tape-out allocation decisions for demand fulfillment planning in semiconductor manufacturing

    المؤلفون: Chien, Chen-Fu, Wu, Jei-Zheng, Wu, Chien-Cheng

    المصدر: Flexible Services and Manufacturing Journal. September 2013 25(3):286-309

    Find this article in full text from Springer Verlag. Find this article in full text from ProQuest Full Text Finder
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  10. 10
    Towards Designing Asynchronous Microprocessors: From Specification to Tape-Out

    المؤلفون: Tallha Akram, Sajjad Ali Haider, Zaheer Tabassam, Musaed Alhussein, Syed Rameez Naqvi, Khursheed Aurangzeb

    المصدر: IEEE Access, Vol 7, Pp 33978-34003 (2019)

    مصطلحات موضوعية: Very-large-scale integration, General Computer Science, Handshake, business.industry, Computer science, Pipeline (computing), 020208 electrical & electronic engineering, Design flow, General Engineering, 020206 networking & telecommunications, 02 engineering and technology, Asynchronous logic, Automation, electronic design and automation, Computer architecture, Asynchronous communication, Robustness (computer science), 0202 electrical engineering, electronic engineering, information engineering, microprocessor, General Materials Science, lcsh:Electrical engineering. Electronics. Nuclear engineering, Tape-out, business, lcsh:TK1-9971, Asynchronous circuit

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7023b0211d7b4a2ab5583c5a316534ce
    https://ieeexplore.ieee.org/document/8660629/

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