المؤلفون: Tasneem, N., Islam, M.M., Wang, Z., Zhao, Z., Upadhyay, N., Lombardo, S.F., Chen, H., Hur, J., Triyoso, D., Consiglio, S., Tapily, K., Clark, R., Leusink, G., Kurinec, S., Datta, S., Yu, S., Ni, K., Passlack, M., Chern, W., Khan, A.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(3):1568-1574 Mar, 2022

المؤلفون: Gong, N., Rasch, M.J., Seo, S.-C., Gasasira, A., Solomon, P., Bragaglia, V., Consiglio, S., Higuchi, H., Park, C., Brew, K., Jamison, P., Catano, C., Saraf, I., Athena, F.F., Silvestre, C., Liu, X., Khan, B., Jain, N., Mcdermott, S., Johnson, R., Estrada-Raygoza, I., Li, J., Gokmen, T., Li, N., Pujari, R., Carta, F., Miyazoe, H., Frank, M.M., Koty, D., Yang, Q., Clark, R., Tapily, K., Wajda, C., Mosden, A., Shearer, J., Metz, A., Teehan, S., Saulnier, N., Offrein, B. J., Tsunomura, T., Leusink, G., Narayanan, V., Ando, T.

المصدر: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :33.7.1-33.7.4 Dec, 2022

Relation: 2022 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Tasneem, N., Islam, M.M., Wang, Z., Chen, H., Hur, J., Triyoso, D., Consiglio, S., Tapily, K., Clark, R., Leusink, G., Yu, S., Chern, W., Khan, A.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 42(8):1156-1159 Aug, 2021

المؤلفون: Kim, Y., Seo, S., Consiglio, S., Jamison, P., Higuchi, H., Rasch, M., Wu, E.Y., Kong, D., Saraf, I., Catano, C., Muralidhar, R., Nguyen, S., DeVries, S., Van der Straten, O., Sankarapandian, M., Pujari, R.N., Gasasira, A., Mcdermott, S.M., Miyazoe, H., Koty, D., Yang, Q., Yan, H., Clark, R., Tapily, K., Engelmann, S., Robison, R.R., Wajda, C., Mosden, A., Tsunomura, T., Soave, R., Saulnier, N., Haensch, W., Leusink, G., Biolsi, P., Narayanan, V., Ando, T.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 42(5):759-762 May, 2021

المؤلفون: Kim, Y., Seo, S.-C., Jamison, P., Consiglio, S., Higuchi, H., Miyazoe, H., Solomon, P., Kim, S., Gokmen, T., Tapily, K., Clark, R. D., Tsunomura, T., Wajda, C. S., Haensch, W., Soave, R., Leusink, G. J., Narayanan, V., Ando, T.

المصدر: 2021 Silicon Nanoelectronics Workshop (SNW) Silicon Nanoelectronics Workshop (SNW), 2021. :1-2 Jun, 2021

Relation: 2021 Silicon Nanoelectronics Workshop (SNW)

المؤلفون: Triyoso, D. H., Clark, R. D., Weinreich, W., Mart, C., Kampfe, T., Consiglio, S., Mukundan, V., Diebold, A., Tapily, K., Wajda, C., Leusink, G.

المصدر: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) VLSI Technology, Systems and Applications (VLSI-TSA), 2021 International Symposium on. :1-2 Apr, 2021

Relation: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)

المؤلفون: Lombardo, S., Nelson, C., Chae, K., Reyes-Lillo, S., Tian, M., Tasneem, N., Wang, Z., Hoffmann, M., Triyoso, D., Consiglio, S., Tapily, K., Clark, R., Leusink, G., Cho, K., Kummel, A., Kacher, J., Khan, A.

المصدر: 2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020

Relation: 2020 IEEE Symposium on VLSI Technology

المؤلفون: Ni, K., Sharma, P., Zhang, J., Jerry, M., Smith, J.A., Tapily, K., Clark, R., Mahapatra, S., Datta, S.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 65(6):2461-2469 Jun, 2018

المؤلفون: Chew, S-A., Yu, H., Schaekers, M., Demuynck, S., Mannaert, G., Kunnen, E., Rosseel, E., Hikavyy, A., Dangol, A., Meyer, K. De, Mocuta, D., Horiguchi, N., Leusink, G., Wajda, C., Hakamata, T., Hasegawa, T., Tapily, K., Clark, R.

المصدر: 2017 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2017 IEEE International. :1-3 May, 2017

Relation: 2017 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Loubet, N., Kal, S., Alix, C., Pancharatnam, S., Zhou, H., Durfee, C., Belyansky, M., Haller, N., Watanabe, K., Devarajan, T., Zhang, J., Miao, X., Sankar, M., Breton, M., Chao, R., Greene, A., Yu, L., Frougier, J., Chanemougame, D., Tapily, K., Smith, J., Basker, V., Mosden, A., Biolsi, P., Hurd, T. Q., Divakaruni, R., Haran, B., Bu, H.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :11.4.1-11.4.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)