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1دورية أكاديمية
المؤلفون: Qinghui Wu, Kesavan Esuvaranathan, Teck Kheng Lee, Soo Leong Foo, Jian Ping Chai, Edmund Chiong
المصدر: Asian Journal of Urology, Vol 10, Iss 3, Pp 364-371 (2023)
مصطلحات موضوعية: Percutaneous nephrolithotomy, Kidney puncture, Renal calculi, Targeting device, Fluoroscopy guidance, Diseases of the genitourinary system. Urology, RC870-923
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Christopher Breach, Teck Kheng Lee, Wee Ling Eddy Chong, Chwee Sim Goh
المصدر: Crystals, Vol 3, Iss 3, Pp 391-404 (2013)
مصطلحات موضوعية: intermetallics, reliability, wire bonding, gold, copper, Crystallography, QD901-999
وصف الملف: electronic resource
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3دورية أكاديمية
المؤلفون: Amit Kumar, Wai Teng Yap, Soo Leong Foo, Teck Kheng Lee
المصدر: Bioengineering, Vol 5, Iss 1, p 18 (2018)
مصطلحات موضوعية: polyetheretherketone, PEEK, DSC, Vickers hardness, medical grade, medical device, Technology, Biology (General), QH301-705.5
وصف الملف: electronic resource
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4دورية أكاديمية
المؤلفون: Teck Kheng Lee, Zhang, S., Wong, C.C., Tan, A.C.
المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 29(1):186-194 Feb, 2006
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5
المؤلفون: Karen Chen, Meng-Kai Shih, Teck Kheng Lee, CP Hung, David Tarng
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:690-696
مصطلحات موضوعية: 010302 applied physics, Fabrication, Materials science, Through-silicon via, 02 engineering and technology, Epoxy, Molding (process), Integrated circuit, 021001 nanoscience & nanotechnology, 01 natural sciences, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, law.invention, Brittleness, law, visual_art, 0103 physical sciences, visual_art.visual_art_medium, Interposer, Wafer, Electrical and Electronic Engineering, Composite material, 0210 nano-technology
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6
المؤلفون: Qinghui Wu, Kesavan Esuvaranathan, Teck Kheng Lee, Soo Leong Foo, Jian Ping Chai, Edmund Chiong
المصدر: Asian Journal of Urology.
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المؤلفون: Soo Leong Foo, Amit Kumar, Wai Teng Yap, Teck Kheng Lee
المصدر: Bioengineering, Vol 5, Iss 1, p 18 (2018)
Bioengineering
Bioengineering; Volume 5; Issue 1; Pages: 18مصطلحات موضوعية: Medical device, Thermoplastic, Materials science, Bioengineering, 02 engineering and technology, Vickers hardness, lcsh:Technology, polyetheretherketone, PEEK, DSC, medical grade, medical device, Article, Differential scanning calorimetry, 0203 mechanical engineering, Peek, Composite material, lcsh:QH301-705.5, chemistry.chemical_classification, Moisture, lcsh:T, Sterilization (microbiology), 021001 nanoscience & nanotechnology, Steam sterilization, 020303 mechanical engineering & transports, chemistry, lcsh:Biology (General), Vickers hardness test, 0210 nano-technology
وصف الملف: application/pdf
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8
المؤلفون: Teck Kheng Lee
المصدر: 2018 IEEE 8th International Nanoelectronics Conferences (INEC).
مصطلحات موضوعية: Microelectromechanical systems, Interconnection, Materials science, Soldering, Hardware_INTEGRATEDCIRCUITS, Nanotechnology, Substrate (printing), Throughput (business), Layer (electronics), Flip chip, Solid liquid
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::81a0b5a509015be7988d28a34f5d6359
https://doi.org/10.1109/inec.2018.8441915 -
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المؤلفون: Teck Kheng Lee, Amit Kumar, Bok Leng Ser
المصدر: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
مصطلحات موضوعية: chemistry.chemical_classification, Materials science, business.industry, Conductive paste, 020206 networking & telecommunications, 02 engineering and technology, Polymer, Fine line, Flip chip interconnect, chemistry, Soldering, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Redistribution layer, business, Solid liquid, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cda370319def245c4f19ecad1b953441
https://doi.org/10.1109/impact.2017.8255916 -
10
المؤلفون: Teck Kheng Lee, Kwok Weng Jimmy Chan, Khin Sandar Tun, Goh Chwee Sim, Manoj Gupta, XingHe Tan, Wai Onn Richard Kwok
المصدر: Advanced Materials Research. 1119:613-616
مصطلحات موضوعية: Compressive strength, Materials science, Ultimate tensile strength, Alloy, Metallurgy, General Engineering, engineering, Intermetallic, engineering.material, Magnesium alloy, Microstructure, Ductility, Indentation hardness