المؤلفون: Qinghui Wu, Kesavan Esuvaranathan, Teck Kheng Lee, Soo Leong Foo, Jian Ping Chai, Edmund Chiong

المصدر: Asian Journal of Urology, Vol 10, Iss 3, Pp 364-371 (2023)

مصطلحات موضوعية: Percutaneous nephrolithotomy, Kidney puncture, Renal calculi, Targeting device, Fluoroscopy guidance, Diseases of the genitourinary system. Urology, RC870-923

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2214388222000017; https://doaj.org/toc/2214-3882

URL الوصول: https://doaj.org/article/9281b453ad20473baf305e61037d12b8

المؤلفون: Christopher Breach, Teck Kheng Lee, Wee Ling Eddy Chong, Chwee Sim Goh

المصدر: Crystals, Vol 3, Iss 3, Pp 391-404 (2013)

مصطلحات موضوعية: intermetallics, reliability, wire bonding, gold, copper, Crystallography, QD901-999

وصف الملف: electronic resource

Relation: http://www.mdpi.com/2073-4352/3/3/391; https://doaj.org/toc/2073-4352

URL الوصول: https://doaj.org/article/6c4d105637924650b79076653b1cfdfa

المؤلفون: Amit Kumar, Wai Teng Yap, Soo Leong Foo, Teck Kheng Lee

المصدر: Bioengineering, Vol 5, Iss 1, p 18 (2018)

مصطلحات موضوعية: polyetheretherketone, PEEK, DSC, Vickers hardness, medical grade, medical device, Technology, Biology (General), QH301-705.5

وصف الملف: electronic resource

Relation: http://www.mdpi.com/2306-5354/5/1/18; https://doaj.org/toc/2306-5354

URL الوصول: https://doaj.org/article/b2c23de96096427392d92e92ec3c535e

المؤلفون: Teck Kheng Lee, Zhang, S., Wong, C.C., Tan, A.C.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 29(1):186-194 Feb, 2006

المؤلفون: Karen Chen, Meng-Kai Shih, Teck Kheng Lee, CP Hung, David Tarng

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:690-696

مصطلحات موضوعية: 010302 applied physics, Fabrication, Materials science, Through-silicon via, 02 engineering and technology, Epoxy, Molding (process), Integrated circuit, 021001 nanoscience & nanotechnology, 01 natural sciences, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, law.invention, Brittleness, law, visual_art, 0103 physical sciences, visual_art.visual_art_medium, Interposer, Wafer, Electrical and Electronic Engineering, Composite material, 0210 nano-technology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::33a3e8943773beae5dbab8d139634e2b
https://doi.org/10.1109/tcpmt.2021.3065647

المؤلفون: Qinghui Wu, Kesavan Esuvaranathan, Teck Kheng Lee, Soo Leong Foo, Jian Ping Chai, Edmund Chiong

المصدر: Asian Journal of Urology.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::eb87c2579cf0068578e0257d28fe3fac
https://doi.org/10.1016/j.ajur.2022.01.001

المؤلفون: Soo Leong Foo, Amit Kumar, Wai Teng Yap, Teck Kheng Lee

المصدر: Bioengineering, Vol 5, Iss 1, p 18 (2018)
Bioengineering
Bioengineering; Volume 5; Issue 1; Pages: 18

مصطلحات موضوعية: Medical device, Thermoplastic, Materials science, Bioengineering, 02 engineering and technology, Vickers hardness, lcsh:Technology, polyetheretherketone, PEEK, DSC, medical grade, medical device, Article, Differential scanning calorimetry, 0203 mechanical engineering, Peek, Composite material, lcsh:QH301-705.5, chemistry.chemical_classification, Moisture, lcsh:T, Sterilization (microbiology), 021001 nanoscience & nanotechnology, Steam sterilization, 020303 mechanical engineering & transports, chemistry, lcsh:Biology (General), Vickers hardness test, 0210 nano-technology

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c1bba38c8b03ae5aaca7c46c563d550b
http://www.mdpi.com/2306-5354/5/1/18

المؤلفون: Teck Kheng Lee

المصدر: 2018 IEEE 8th International Nanoelectronics Conferences (INEC).

مصطلحات موضوعية: Microelectromechanical systems, Interconnection, Materials science, Soldering, Hardware_INTEGRATEDCIRCUITS, Nanotechnology, Substrate (printing), Throughput (business), Layer (electronics), Flip chip, Solid liquid

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::81a0b5a509015be7988d28a34f5d6359
https://doi.org/10.1109/inec.2018.8441915

المؤلفون: Teck Kheng Lee, Amit Kumar, Bok Leng Ser

المصدر: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

مصطلحات موضوعية: chemistry.chemical_classification, Materials science, business.industry, Conductive paste, 020206 networking & telecommunications, 02 engineering and technology, Polymer, Fine line, Flip chip interconnect, chemistry, Soldering, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Redistribution layer, business, Solid liquid, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cda370319def245c4f19ecad1b953441
https://doi.org/10.1109/impact.2017.8255916

المؤلفون: Teck Kheng Lee, Kwok Weng Jimmy Chan, Khin Sandar Tun, Goh Chwee Sim, Manoj Gupta, XingHe Tan, Wai Onn Richard Kwok

المصدر: Advanced Materials Research. 1119:613-616

مصطلحات موضوعية: Compressive strength, Materials science, Ultimate tensile strength, Alloy, Metallurgy, General Engineering, engineering, Intermetallic, engineering.material, Magnesium alloy, Microstructure, Ductility, Indentation hardness

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4c3e4b1d882f9baa9a0e78e9fb7ba89b
https://doi.org/10.4028/www.scientific.net/amr.1119.613