المؤلفون: Yang, Tien-Fu, Zheng, Le-Zheu^{Aff2, Aff3}, Lin, Cong-You, Teng, Li-Tao, Yan, Wei-Mon^{Aff2, Aff3, IDs10973023126922_cor5}, Rashidi, Saman

المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. 148(24):14081-14096

المؤلفون: Yang, Tien-Fu, Zheng, Le-Zheu, Teng, Li-Tao, Rashidi, Saman, Yan, Wei-Mon

المصدر: In Thermal Science and Engineering Progress January 2024 47

المؤلفون: Sue, Chung-Yang, Lin, Chih-Che, Tsai, Chun-Yin, Chen, Chih-Yuan, Teng, Li-Tao, Chen, Wei-Liang, Lin, Chih-Hsiou, Shiau, Jieh-Ling

المصدر: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016 11th International. :357-360 Oct, 2016

Relation: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Yang, Tien-Fu, Lin, Pei-Yi, Teng, Li-Tao, Rashidi, Saman, Yan, Wei-Mon

المصدر: In Journal of Power Sources 15 November 2022 548

المؤلفون: Chiu, Sheng-Ren, Sue, Chung-Yang, Lin, Chih-Hsiou, Teng, Li-Tao, Liao, Lu-Pu, Hsu, Yu-Wen, Su, Yan-Kuin

المصدر: 2012 IEEE Sensors Sensors, 2012 IEEE. :1-4 Oct, 2012

Relation: 2012 IEEE Sensors

المؤلفون: Chiu, Sheng-Ren, Sue, Chung-Yang, Liao, Lu-Pu, Teng, Li-Tao, Hsu, Yu-Wen, Su, Yan-Kuin

المصدر: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International. :315-318 Oct, 2011

Relation: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Chiu, Sheng-Ren, Chen, Jen-Yi, Teng, Li-Tao, Sue, Chung-Yang, Lin, Shih-Ting, Hsu, Yu-Wen, Su, Yan-Kuin

المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International. :1-4 Oct, 2010

Relation: 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Chiu, Sheng-Ren, Chen, Jen-Yi, Lin, Shih-Chieh, Teng, Li-Tao, Lin, Shih-Ting, Shiau, Jieh-Ling, Hsu, Yu-Wen, Su, Yan-Kuin

المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International. :1-4 Oct, 2010

Relation: 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Lin, Faa-Jeng, Teng, Li-Tao, Shieh, Po-Huang

المصدر: IECON 2007 - 33rd Annual Conference of the IEEE Industrial Electronics Society Industrial Electronics Society, 2007. IECON 2007. 33rd Annual Conference of the IEEE. :671-676 Nov, 2007

Relation: 2007 33rd Annual Conference of the IEEE Industrial Electronics Society

المؤلفون: Lin, Faa-Jeng, Teng, Li-Tao, Chang, Chih-Kai

المصدر: IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics IEEE Industrial Electronics, IECON 2006 - 32nd Annual Conference on. :1269-1274 Nov, 2006

Relation: IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics