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المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :542-547 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Shih, Victor, Cheng, Sean, Lin, You-Ru, Lin, Anderson, Liao, Yan-Jie, Lin, Ching-Hui, Huang, Fu-Chun, Tai, Kelvin, Hu, Fan, Tsai, Yi-Heng, Chen, Yen-Wen, Chang, Kai-Fung, Chiu, Ching-Hua, Tsai, Leo, Teng, Vincent, Chen, Chih-Ming, Yu, Terrence, Tu, Yeur-Luen, Tseng, Lee-Chuan, Lee, Julian, Chen, Benior, Huang, Shih-Fen, Kalnitsky, Alexander

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Relation: 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

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المؤلفون: Sturges, Paul, Teng, Vincent, Iliffe, Ursula

المصدر: Library Management, 2001, Vol. 22, Issue 8/9, pp. 364-370.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/01435120110406309

المؤلفون: Chih-Ju Jou, Chien-Li Lee, Yue-Teng Vincent Fu, Chih-Ming Kao

المصدر: Sustainable Environment Research; Jul2012, Vol. 22 Issue 4, p255-260, 6p, 2 Diagrams, 4 Charts, 2 Graphs