يعرض 1 - 10 نتائج من 20 نتيجة بحث عن '"Teng, Wen-Yu"', وقت الاستعلام: 1.04s تنقيح النتائج
  1. 1
    مؤتمر
    Underfill Selection Guideline for Fan-Out Heterogeneous Integration Package

    المؤلفون: Teng, Wen-Yu, Hung, Liang-Yih, Lee, Jackson, Li, Debby, Chen, Carl, Jiang, Don-Son, Wang, Yu-Po

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1993-1997 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Advanced TIM Material Analysis for High Performance Package Applications

    المؤلفون: Jhan, Jyun-De, Teng, Wen-Yu, Hung, Liang-Yih, Chen, Carl, Wang, Yu-Po

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :229-230 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  3. 3
    مؤتمر
    Study of Solder Resist Crack Resistance for Flip Chip Ball Grid Array Substrate

    المؤلفون: Chen, Eric, Ye, Rick, Teng, Wen-Yu, Pei, Yu-Cheng, Wang, Yu-Po

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1531-1535 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Effect of Underfill Additive Agents on Crack Prevention in Large Fan-Out Multichip Module Packages

    المؤلفون: Chen, Ching-Chia, Teng, Wen-Yu, Tsai, Fang Lin, Lee, Jackson, Hung, Liang Yih, Jiang, Don Son, Wang, Yu-Po

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :477-480 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  5. 5
    مؤتمر
    Study of Parameter Tuning for the Curing Condition on ABF Type for Large FCBGA Package

    المؤلفون: Ye, Rick, Chen, Eric, Teng, Wen-Yu, Kang, Andrew, Wang, Yu-Po

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1987-1990 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    Investigation of Solder Resist Opening Uniformity on Flip Chip Substrate

    المؤلفون: Ni, Yuan-Chang, Teng, Wen-Yu, Pai, Yu-Cheng, Chen, Carl, Wang, Yu-Po

    المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :255-256 Apr, 2023

    Relation: 2023 International Conference on Electronics Packaging (ICEP)

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  7. 7
    مؤتمر
    Stress and Reliability of Underfills in Heterogeneous Integration Fan-Out Multichip Module Packages

    المؤلفون: Teng, Wen-Yu, Lee, Jackson, Hung, Liang-Yih, Jiang, Don-Son, Wang, Yu-Po

    المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :235-236 Apr, 2023

    Relation: 2023 International Conference on Electronics Packaging (ICEP)

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  8. 8
    مؤتمر
    Advanced Thermal Lid Attach Adhesive for High Performance Computing (HPC) Package

    المؤلفون: Teng, Wen-Yu, Lee, Jackson, Tseng, Hsin-Ming, Hung, Liang-Yi, Jiang, Don Son, Wang, Yu-Po

    المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :126-130 Dec, 2021

    Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

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  9. 9
    مؤتمر
    Stress and Reliability Challenges of Underfills in Large-Size Fan-Out Multichip Module Packages

    المؤلفون: Teng, Wen-Yu, Lee, Jackson, Tseng, Hsin-Ming, Hung, Liang Yih, Son Jiang, Don, Wang, Yu-Po

    المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :225-226 May, 2022

    Relation: 2022 International Conference on Electronics Packaging (ICEP)

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  10. 10
    مؤتمر
    Study of Measurement Index on the Polymer-to-Metal Direct-adhesion for Package Carrier

    المؤلفون: Pai, Yu-Cheng, Yeh, Chan-Yu, Teng, Wen-Yu, Kang, Andrew, Wang, Yu-Po

    المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :227-228 May, 2022

    Relation: 2022 International Conference on Electronics Packaging (ICEP)

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