المؤلفون: Tan, P. K., Pan, Y. L., Ting, S. L., Quah, A. C. T., Tam, Y. S., Teo, Angela, Xu, N. Y., Thoungh, H. H. W., Kang, K. K., Yu, T. T., Chen, C. Q.

المصدر: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-6 Jul, 2022

Relation: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Teo, Angela, Boon, Ang Ghim, Peng, Ng Hui, Qing, Chen Chang, Yun, Xu Nai, Dayanand, N., Seng, Tam Yong, Hong, Mai Zhi, Lam, Jeffrey

المصدر: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-5 Jul, 2018

Relation: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Ng, P.T., Chen, C.Q., Tam, Y.S., Yip, K.H., Teo, Angela, Ang, G.H., Mai, Z.H., Lam, Jeffrey

المصدر: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-4 Jul, 2018

Relation: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Xu, N. Y., Teo, Angela, Ng, H. P., Ang, G. B., Chen, C. Q., Jerome, A., Mai, Z. H., Lam, J.

المصدر: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2017 IEEE 24th International Symposium on the. :1-4 Jul, 2017

Relation: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Teo, Angela, Peng, Ng Hui, Boon, Ang Ghim, Qing, Chen Chang, Yun, Xu Nai, Dayanand, N, Seng, Tam Yong, Hong, Mai Zhi, Lam, Jeffrey

المصدر: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2017 IEEE 24th International Symposium on the. :1-5 Jul, 2017

Relation: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Seungje, Moon, Nagalingam, D., Quah, A. C. T., Ang, G. B., Ng, H. P., Teo, Angela, Xu, N. Y., Mai, Z. H., Lam, J.

المصدر: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2016 IEEE 23rd International Symposium on the. :11-16 Jul, 2016

Relation: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Ng, H. P., Xu, N. Y., Teo, Angela, Ang, G. B., Quah, A. C. T., Dayanand, Chen, C. Q., Mai, Z. H., Lam, J.

المصدر: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2016 IEEE 23rd International Symposium on the. :414-417 Jul, 2016

Relation: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Chen changqing, Ang Ghim Boon, Teo, Angela, Neo Soh Ping, Wang Qingxiao

المصدر: 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the. :1-4 Jul, 2010

Relation: 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010)

المؤلفون: Chen, C.Q., Ang, G.B., Ng, P.T., Rivai, Francis, Ng, H.P., Quah, A.C.T., Teo, Angela, Lam, Jeffery, Mai, Z.H.

المصدر: In Microelectronics Reliability September 2017 76-77:261-266

المؤلفون: Alfred Quah, Teo Angela, Zhihong Mai, Tam Yong Seng, Ang Ghim Boon, C. Q. Chen, Ng Hui Peng, Jeffrey Lam, Yip Kim Hong

المصدر: International Symposium for Testing and Failure Analysis.

مصطلحات موضوعية: Materials science

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fb8571cf218c72e6bfe8081aa734a585
https://doi.org/10.31399/asm.cp.istfa2014p0250