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1دورية أكاديمية
المؤلفون: Yuki Nakamura, Yukiko Nogami, Yoko Iwase, Mio Hozawa, Tetsuya Sotome, Issei Saitoh, Akitsugu Ohuchi, Haruaki Hayasaki
المصدر: BMC Public Health, Vol 24, Iss 1, Pp 1-11 (2024)
مصطلحات موضوعية: Dental caries, Child abuse, Neglect, Children under temporary protective care, Public aspects of medicine, RA1-1270
وصف الملف: electronic resource
Relation: https://doaj.org/toc/1471-2458
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2مؤتمر
المؤلفون: Asakawa, Tetsuya, Shinoda, Hiroki, Shimizu, Kazuki, Nomura, Kei, Aono, Masaki
المصدر: 2024 IEEE 37th International Symposium on Computer-Based Medical Systems (CBMS) CBMS Computer-Based Medical Systems (CBMS), 2024 IEEE 37th International Symposium on. :9-14 Jun, 2024
Relation: 2024 IEEE 37th International Symposium on Computer-Based Medical Systems (CBMS)
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3مؤتمر
المؤلفون: Yasuda, Hidefumi, Ueda, Tetsuya
المصدر: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024 Microwave Symposium - IMS 2024, 2024 IEEE/MTT-S International. :555-558 Jun, 2024
Relation: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024
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4مؤتمر
المؤلفون: Nishibori, Toshiyuki, Okada, Nozomi, Kimura, Kimihiro, Sato, Toshio, Tamesue, Kazuhiko, Jitsuno, Kunihisa, Sato, Takuro, Kawanishi, Tetsuya
المصدر: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024 Microwave Symposium - IMS 2024, 2024 IEEE/MTT-S International. :429-432 Jun, 2024
Relation: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024
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5مؤتمر
المؤلفون: Takahashi, Ryohei, Misumi, Kei, Tsuji, Keigo, Eiler, Anne-Claire, Yasunaga, Shun, Higo, Akio, Nakane, Ryosho, Iizuka, Tetsuya
المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-5 Jun, 2024
Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
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6مؤتمر
المصدر: 2024 Optical Fiber Communications Conference and Exhibition (OFC) Optical Fiber Communications Conference and Exhibition (OFC), 2024. :1-3 Mar, 2024
Relation: 2024 Optical Fiber Communications Conference and Exhibition (OFC)
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7مؤتمر
المؤلفون: Uemura, Hiroshi, Misawa, Taichi, Mizuno, Yasutaka, Itabashi, Naoki, Arao, Hajime, Nakanishi, Tetsuya, Tanaka, Keiji, Sano, Tomomi, Uesaka, Katsumi, Miyairi, Mami, Ishizuki, Yoshikatsu, Sakai, Taiji, Kurita, Yoichiro
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :90-95 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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8مؤتمر
المؤلفون: Shino, Tatsunori, Murugesan, Mariappan, Mori, Kiyoharu, Tanaka, Bungo, Toyama, Eitaro, Nishiguchi, Tetsuya, Fukushima, Takafumi
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2042-2046 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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9مؤتمر
المؤلفون: Lynn, Nay Chi, Shimamura, Tetsuya
المصدر: 2024 IEEE 14th Symposium on Computer Applications & Industrial Electronics (ISCAIE) Computer Applications & Industrial Electronics (ISCAIE), 2024 IEEE 14th Symposium on. :1-4 May, 2024
Relation: 2024 IEEE 14th Symposium on Computer Applications & Industrial Electronics (ISCAIE)
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10مؤتمر
المؤلفون: Hoshino, Takuya, Sao, Masaharu, Tominaga, Tetsuya
المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :681-684 May, 2024
Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)