المؤلفون: Glaubitz, C., Thalmann, R., Friedrichson, T., Ariffin, M.A., Bieck, F., Teutsch, T., Oppert, T.

المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :948-953 Dec, 2018

Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Teutsch, T., Mesch, M., Giessen, H., Tarin, C.

المصدر: 2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) Engineering in Medicine and Biology Society (EMBC), 2015 37th Annual International Conference of the IEEE. :6421-6424 Aug, 2015

Relation: 2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

المؤلفون: Teutsch, T., Mesch, M., Giessen, H., Tarin, C.

المصدر: 2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE. :2081-2084 Aug, 2014

Relation: 2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

المؤلفون: Teutsch, T., Blankenhorn, R.G., Zakel, E.

المصدر: 53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :1468-1471 2003

Relation: 53rd Electronic Components and Technology Conference, 2003. Proceedings.

المؤلفون: Herbsommer, J., Teutsch, T., Strandjord, A.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 12(2):317-322 Jun, 2012

المؤلفون: Teutsch, T., Oppert, T., Zakel, E., Klusmann, E., Meyer, H., Schulz, R., Schulze, J.

المصدر: 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Electronic components and technology Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th. :107-113 2000

Relation: 2000 Proceedings. 50th Electronic Components and Technology Conference

المؤلفون: Oppert, T., Teutsch, T., Zakel, E.

المصدر: International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Electronic materials and packaging Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on. :72-78 2000

Relation: International Symposium on Electronic Materials and Packaging (EMAP2000)

المؤلفون: Oppert, T., Teutsch, T., Zakel, E., Tovar, D.

المصدر: Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE/CPMT. :328-333 1999

Relation: Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium

المؤلفون: Teutsch, T., Strohfeldt, N., Sterl, F., Warsewa, A., Herkert, E., Paone, D., Giessen, H., Tarin, C.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 18(5):1946-1959 Mar, 2018

المؤلفون: Oppert, T., Zakel, E., Teutsch, T.

المصدر: 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Electronic manufacturing technology and microelectronics IEMT/IMC Symposium, 2nd 1998. :106-113 1998

Relation: 2nd 1998 IEMT/IMC Symposium