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1تقرير
المؤلفون: Schnetz, Oliver, Theil, Simon
مصطلحات موضوعية: High Energy Physics - Theory
URL الوصول: http://arxiv.org/abs/2407.17133
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2تقرير
المؤلفون: Naver, Estrid Buhl, Yetik, Okan, Ott, Noémie, Busi, Matteo, Trtik, Pavel, Kuhn, Luise Theil, Strobl, Markus
مصطلحات موضوعية: Condensed Matter - Materials Science
URL الوصول: http://arxiv.org/abs/2405.14510
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3مؤتمر
المؤلفون: Mirkarimi, Laura, Workman, Thomas, Theil, Jeremy, Fountain, Gill, Bang, KM, Zhao, Oliver, Lee, Bongsub, Uzoh, Cyprian, Suwito, Dominik, Gao, Guilian
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :83-90 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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4دورية أكاديمية
المؤلفون: Cook, Sarah, Wittenburg, Luke, Yan, Victoria C, Theil, Jacob H, Castillo, Diego, Reagan, Krystle L, Williams, Sonyia, Pham, Cong-Dat, Li, Chun, Muller, Florian L, Murphy, Brian G
المصدر: Viruses. 16(3)
مصطلحات موضوعية: Microbiology, Biological Sciences, Infection, Good Health and Well Being
وصف الملف: application/pdf
URL الوصول: https://escholarship.org/uc/item/5sb4h1k2
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5دورية أكاديمية
المؤلفون: Swift, IJ, Rademakers, R, Finch, N, Baker, M, Ghidoni, R, Benussi, L, Binetti, G, Rossi, G, Synofzik, M, Wilke, C, Mengel, D, Graff, C, Takada, LT, Sanchez-Valle, R, Antonell, A, Galimberti, D, Fenoglio, C, Serpente, M, Arcaro, M, Schreiber, S, Vielhaber, S, Arndt, P, Santana, I, Almeida, MR, Moreno, F, Barandiaran, M, Gabilondo, A, Stubert, J, Gomez-Tortosa, E, Agueero, P, Sainz, MJ, Gohda, T, Murakoshi, M, Kamei, N, Kittel-Schneider, S, Reif, A, Weigl, J, Jian, JL, Liu, CJ, Serrero, G, Greither, T, Theil, G, Lohmann, E, Gazzina, S, Bagnoli, S, Coppola, G, Bruni, A, Quante, M, Kiess, W, Hiemisch, A, Jurkutat, A, Block, MS, Carlson, AM, Brathen, G, Sando, SB, Grontvedt, GR, Lauridsen, C, Heslegrave, A, Heller, C, Abel, E, Gomez-Nunez, A, Puey, R, Arighi, A, Rotondo, E, Jiskoot, LC, Meeter, LHH, Duraes, J, Lima, M, Tabuas-Pereira, M, Lemos, J, Boeve, B, Petersen, RC, Dickson, DW, Graff-Radford, NR, Leber, I, Sellami, L, Lamari, F, Clot, F, Borroni, B, Cantoni, V, Rivolta, J, Lleo, A, Fortea, J, Alcolea, D, Illan-Gala, I, Andres-Cerezo, L, Van Damme, P, Clarimon, J, Steinacker, P, Feneberg, E, Otto, M, van der Ende, EL, van Swieten, JC, Seelaar, H, Zetterberg, H, Sogorb-Esteve, A, Rohrer, JD
المصدر: Alzheimer's research & therapy. 16(1):66
مصطلحات موضوعية: Medicin och hälsovetenskap
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6دورية أكاديمية
المؤلفون: Creed, ChrisAff1, IDs10209023009690_cor1, Al-Kalbani, Maadh, Theil, Arthur, Sarcar, Sayan, Williams, Ian
المصدر: Universal Access in the Information Society: International Journal. 23(1):59-73
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7تقرير
مصطلحات موضوعية: Mathematics - Numerical Analysis, Mathematics - Optimization and Control
URL الوصول: http://arxiv.org/abs/2307.14269
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8مؤتمر
المؤلفون: Gao, Guilian, Mirkarimi, Laura, Fountain, Gill, Suwito, Dominik, Theil, Jeremy, Workman, Thomas, Uzoh, Cyprian, Lee, Bongsub, Bang, K.M., Guevara, Gabe
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1975-1981 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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9مؤتمر
المؤلفون: Mirkarimi, Laura, Uzoh, Cyprian, Suwito, Dominik, Lee, Bongsub, Fountain, Gill, Workman, Thomas, Theil, Jeremy, Gao, Guilian, Buckalew, Bryan, Oberst, Justin, Ponnuswamy, Thomas
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :162-167 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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10مؤتمر
المؤلفون: Theil, Jeremy A., Workman, Thomas, Suwito, Dominik, Mirkarimi, Laura, Fountain, Gill, Bang, KM, Gao, Guilian, Lee, Bongsub, Mrozek, Pawel, Uzoh, Cyprian, Huynh, Michael, Zhao, Oliver
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :130-136 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)