المؤلفون: Garay Martinez, Roberto

المساهمون: University/Department: Universitat de Lleida. Departament de Medi Ambient i Ciències del Sòl

مرشدي الرسالة: Chemisana Villegas, Daniel

المصدر: TDX (Tesis Doctorals en Xarxa)

مصطلحات موضوعية: Transferencia de calor, Puente térmico, Edificación, Heat Transfer, Thermal bridge, Buildings, Física Aplicada

وصف الملف: application/pdf

URL الوصول: http://hdl.handle.net/10803/460756

المؤلفون: Fişne, Alparslan, Yurtsever, M. Mücahit Enes, Eken, Süleyman^{Aff2, IDs1058602404624y_cor3}

المصدر: Cluster Computing: The Journal of Networks, Software Tools and Applications. 27(9):12787-12797

المؤلفون: Boronbaev, Erkin^Aff9

المساهمون: di Prisco, Marco, Series Editor^Aff1, Chen, Sheng-Hong, Series Editor^Aff2, Vayas, Ioannis, Series Editor^Aff3, Kumar Shukla, Sanjay, Series Editor^Aff4, Sharma, Anuj, Series Editor^Aff5, Kumar, Nagesh, Series Editor^Aff6, Wang, Chien Ming, Series Editor^Aff7, Jeon, Han-Yong, editor^Aff8

المصدر: Proceedings of the International Conference on Geosynthetics and Environmental Engineering. 374:251-259

المؤلفون: Li, Meilin, Sun, Huanhuan, Zhou, Jun, Zhao, Yunshan^{Aff1, IDs114670231351x_cor4}

المصدر: Frontiers of Physics. 19(3)

المؤلفون: Dandan Zhang, Shuping Jiang, Peng Cao, Enlong Liu, Mengjun Wu, Wenliang Jin

المصدر: Case Studies in Thermal Engineering, Vol 60, Iss , Pp 104655- (2024)

مصطلحات موضوعية: Tunnel engineering, Thermal bridge effect, Thermal insulation scheme, Physical model tests, Steel-concrete-steel tunnel structure, Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2214157X24006865; https://doaj.org/toc/2214-157X

URL الوصول: https://doaj.org/article/893f8e0913c7487599a5f2c262c4060b

المؤلفون: Noh, J., Chowdhury, P.R., Segovia, M., Alajlouni, S., Si, M., Charnas, A.R., Huang, S., Maize, K., Shakouri, A., Xu, X., Ruan, X., Ye, P.D.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(3):1186-1190 Mar, 2022

المؤلفون: Xiaoyu Gu, Yujie Huang, Muhammad Ali, Zheng Wang

المصدر: Journal of Asian Architecture and Building Engineering, Vol 0, Iss 0, Pp 1-13 (2024)

مصطلحات موضوعية: glulam structure, air tightness, indoor temperature and humidity, thermal bridge, thermal comfort, Architecture, NA1-9428, Building construction, TH1-9745

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1347-2852

URL الوصول: https://doaj.org/article/53f14e141c3f46d9a85a5b0bbaa42885

المؤلفون: Yan Zhou, Xiaoyu Jin, Yihui Wang, Difang Wei

المصدر: Journal of Asian Architecture and Building Engineering, Vol 0, Iss 0, Pp 1-12 (2023)

مصطلحات موضوعية: shear wall thermal bridge (swtb), influence area of thermal bridge, linear heat transfer coefficient, thermal resistance, 2d heat transfer, Architecture, NA1-9428, Building construction, TH1-9745

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1347-2852

URL الوصول: https://doaj.org/article/462aefc6eedd42fcaf1e620e56890b90

المؤلفون: Nguyen Huu Cuong, Hyoseo An, Tran-Van Han, Sanghee An, Jiuk Shin, Kihak Lee

المصدر: Results in Engineering, Vol 22, Iss , Pp 102191- (2024)

مصطلحات موضوعية: Thermal bridge, Experiment, Shear strength, UHPC, LS-DYNA, Technology

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2590123024004456; https://doaj.org/toc/2590-1230

URL الوصول: https://doaj.org/article/11c83be6ab3a41a4a0de11ad189d679e

المؤلفون: Zhang, Hengyun, Zhou, Zhifeng, Wu, Minghui, Cai, Yan, Yu, Mingbin, Lin, Tingyu

المصدر: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-6 Aug, 2020

Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)