يعرض 1 - 10 نتائج من 473 نتيجة بحث عن '"Thermal budget"', وقت الاستعلام: 0.97s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Investigation of Hf₀.₅Zr₀.₅O₂ Ferroelectric Films at Low Thermal Budget (300 °C)

    المؤلفون: Dai, S., Chai, J., Duan, J., Xiang, J., Han, K., Wang, Y., Xu, H., Zhang, J., Wang, X., Wang, W.

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(8):5150-5155 Aug, 2024

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  2. 2
    دورية أكاديمية
    Demonstration of EOT-Scaled FinFET Based on Thickness-Proportion Controlled HZH Superlattice Gate Stacks With Improved Thermal Stability (≥ 450 °C)

    المؤلفون: Zhong, K., Zhang, F., Zhang, Z., Zhang, Q., Hou, Z., Zhao, C., Han, G., Xu, G., Li, J., Liu, Y., Xu, J., Yin, H.

    المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 45(7):1193-1196 Jul, 2024

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  3. 3
    مؤتمر
    Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications

    المؤلفون: Cheemalamarri, Hemanth Kumar, Van Nhat Anh, Tran, Guan, Chen Gim, Lim, Meng Keong, Vempati, Srinivasa Rao, Singh, Navab

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1880-1884 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding

    المؤلفون: De Messemaeker, Joke, Van Sever, Koen, Tsau, Yan Wen, Zhang, Boyao, Croes, Kristof, Beyne, Eric

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1853-1858 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    SILC and TDDB reliability of novel low thermal budget RMG gate stacks

    المؤلفون: Vici, Andrea, Degraeve, Robin, Horiguchi, Naoto, De Wolf, Ingrid, Franco, Jacopo

    المصدر: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :1-6 Apr, 2024

    Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)

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  6. 6
    دورية أكاديمية
    Ferroelectricity of Hf0.5Zr0.5O2 Thin Film Induced at 350°C by Thermally Accelerated Nucleation During Atomic Layer Deposition

    المؤلفون: Lee, J., Kim, S.H., Choi, H., Jeong, H.W., Yang, K., Park, J.Y., Cho, Y.H., Park, S., Lee, Y., Park, M.H.

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(4):2690-2695 Apr, 2024

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  7. 7
    مؤتمر
    A Study of the Effects of Thermal Budget on 3D-NAND Charge Trap Cell Reliability

    المؤلفون: Aoulaiche, Marc, Venkatesan, Srinath, Lee, Donghwa, Sharbati, Mohammad Taghi, Nawaz, Seeraz, Jung, Kyubong

    المصدر: 2024 IEEE Workshop on Microelectronics and Electron Devices (WMED) Microelectronics and Electron Devices (WMED), 2024 IEEE Workshop on. :1-4 Mar, 2024

    Relation: 2024 IEEE Workshop on Microelectronics and Electron Devices (WMED)

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  8. 8
    مؤتمر
    Optimizing Tandem Solar Cell Efficiency: A Perovskite-CIGS Approach

    المؤلفون: Chakraborty, Arpita, Chakraborty, Aditya, Khan, Fariba Tasnia, Mahmud, Tanjim, Hossain, Mohammad Shahadat, Andersson, Karl

    المصدر: 2024 Second International Conference on Emerging Trends in Information Technology and Engineering (ICETITE) Emerging Trends in Information Technology and Engineering (ICETITE), 2024 Second International Conference on. :1-5 Feb, 2024

    Relation: 2024 Second International Conference on Emerging Trends in Information Technology and Engineering (ICETITE)

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  9. 9
    مؤتمر
    Enhanced Polarization, Endurance, and Long Retention in Low Temperature Processed W/Hf0.5Zr0.5O2/W Ferroelectric Capacitor for Back-End-of-Line Integration

    المؤلفون: Ali, Md Hanif, Pandey, Adityanarayan, Shirodkar, Soham, Srinu, Rowtu, Meihar, Paritosh, Ganguly, Udayan, Deshpande, Veeresh

    المصدر: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2024 8th IEEE. :1-3 Mar, 2024

    Relation: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

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  10. 10
    مؤتمر
    Trade-off Between Thermal Budget and Thickness Scaling: A Bottleneck on Quest for BEOL Compatible Ultra-Thin Ferroelectric Films Sub-5nm

    المؤلفون: Chiu, Chui-Yi, De, Sourav, Cho, Chen-Yi, Hou, Tuo-Hung

    المصدر: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2024 8th IEEE. :1-3 Mar, 2024

    Relation: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

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