المؤلفون: Hou, Huachen, Yao, Ran, Li, Hui, Zhou, Bailin, Duan, Zeyu, Chen, Zhongyuan, Li, Jinyuan, Wang, MiaoRui

المصدر: 2023 IEEE Sustainable Power and Energy Conference (iSPEC) Sustainable Power and Energy Conference (iSPEC), 2023 IEEE. :1-7 Nov, 2023

Relation: 2023 IEEE Sustainable Power and Energy Conference (iSPEC)

المؤلفون: Wang, Yuqi, Yao, Ran, Li, Hui, Zhou, Bailing, Duan, Zeyu, Chen, Zhongyuan, Li, Jinyuan, Wang, MiaoRui

المصدر: 2023 IEEE Sustainable Power and Energy Conference (iSPEC) Sustainable Power and Energy Conference (iSPEC), 2023 IEEE. :1-7 Nov, 2023

Relation: 2023 IEEE Sustainable Power and Energy Conference (iSPEC)

المؤلفون: Akram, U., Hatakeyama, T., Kibushi, R.

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :235-236 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Qin, F., Zhang, Y., An, T., Zhou, R.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 23(4):444-452 Dec, 2023

المؤلفون: Kemerli, Ubade, Joshi, Yogendra

المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-7 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Rathore, Sunil, Banchhor, Shashank Kumar, Jaisawal, Rajeewa Kumar, Dixit, Ankit, Kondekar, Pravin, Bagga, Navjeet

المصدر: 2022 IEEE International Conference on Emerging Electronics (ICEE) Emerging Electronics (ICEE), 2022 IEEE International Conference on. :1-4 Dec, 2022

Relation: 2022 IEEE International Conference on Emerging Electronics (ICEE)

المؤلفون: Liu, Haiyang^{Aff1, Aff2}, Feng, Xianying^{Aff1, Aff2}, Li, Peigang^{Aff1, Aff2, IDs0017002413408y_cor3}, Liu, Yandong^{Aff1, Aff2}, Li, Yanfei^{Aff1, Aff2}, Yao, Ming^{Aff1, Aff2}

المصدر: The International Journal of Advanced Manufacturing Technology. 132(1-2):907-924

المؤلفون: Mengya Sun, Peng Wu, Bin Shi, Jin Liu, Jie Liu, Juncheng Yao, Yipin Lu, Yunqiang Wang, Xiaoyan Li

المصدر: Journal of Rock Mechanics and Geotechnical Engineering, Vol 16, Iss 7, Pp 2715-2731 (2024)

مصطلحات موضوعية: Soil water content, Actively heated fiber-optic (AHFO) technology, Soil–sensor thermal contact resistance, Reliability, In situ application, Engineering geology. Rock mechanics. Soil mechanics. Underground construction, TA703-712

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S1674775524002130; https://doaj.org/toc/1674-7755

URL الوصول: https://doaj.org/article/76f5ea8e01084efa8ce23797c40f3213

المؤلفون: He, W., Feng, Y., Wu, S., Wang, W.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(3):356-364 Mar, 2023

المؤلفون: Huang, Zuoyi, An, Tong, Qin, Fei, Gong, Yanpeng, Dai, Yanwei, Chen, Pei

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)