يعرض 1 - 10 نتائج من 200 نتيجة بحث عن '"Thermal cycle test"', وقت الاستعلام: 1.14s تنقيح النتائج
  1. 1
    مؤتمر
    A robust mesh size control technology suitable for various empirical equations for predicting solder joint reliability

    المؤلفون: Chiang, Kuo-Ning, Lee, C. E., Yuan, Cadmus

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :234-239 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    A Short Time and Ni-sinterable Cu Sinter Paste with Highly Dispersed Submicron Cu Particles

    المؤلفون: Eyama, Takaaki, Suzuki, Ukyo, Inaya, Shuichi, Takesue, Masafumi

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1655-1659 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Low cycle fatigue of an interface between a substrate and molding resin in a power module

    المؤلفون: Ikeda, Toru, Nakagawa, Shu, Koganemaru, Masaaki, Kakara, Takeshi

    المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :73-74 Apr, 2023

    Relation: 2023 International Conference on Electronics Packaging (ICEP)

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  4. 4
    مؤتمر
    Experimental Study on Thermal Fatigue Life Prediction Model of PBGA Solder Joints

    المؤلفون: Shao, Jiang

    المصدر: 2019 Prognostics and System Health Management Conference (PHM-Qingdao) Prognostics and System Health Management Conference (PHM-Qingdao), 2019. :1-5 Oct, 2019

    Relation: 2019 Prognostics and System Health Management Conference (PHM-Qingdao)

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  5. 5
    دورية أكاديمية
    Charpy absorbed energy in simulated heat-affected zone of laser-arc hybrid welded joints by high-strength steel for bridge structures

    المؤلفون: Chen, Gang, Hirohata, MikihitoAff1, IDs00170023114202_cor2, Sakai, Natsumi, Hyoma, Kengo, Matsumoto, Naoyuki, Inose, Koutarou

    المصدر: The International Journal of Advanced Manufacturing Technology. 127(5-6):2655-2669

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  6. 6
    مؤتمر
    The Effect of the SnAg Solder Joint Morphology on the Thermal Cycle Reliability of 40 µm Fine-Pitch Cu-Pillar/SnAg Micro Bump Interconnection

    المؤلفون: Lee, SeYong, Lee, HanMin, Park, JongHo, Shin, SangMyung, Kim, WooJeong, Choi, TaeJin, Paik, Kyung-Wook

    المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :649-655 May, 2018

    Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Fatigue strength of through hole in printed circuit board

    المؤلفون: Iwade, Shogo, Kinoshita, Takahiro, Kawakami, Takashi, Mizushina, Hideki, Iinaga, Hiroshi

    المصدر: 2014 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2014 International Conference on. :517-520 Apr, 2014

    Relation: 2014 International Conference on Electronics Packaging (ICEP)

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  8. 8
    مؤتمر
    Impact of thermal cycle on end-face geometry of laser processed LC and standard LC connectors

    المؤلفون: Thongdaeng, Rutsuda, Wangsan, Sathit, Berdinskikh, Tatiana, Suurmann, Robert, Culbert, John M, Hogberg, Daniel

    المصدر: The 2012 11th International Conference on Optical Communications and Networks (ICOCN) Optical Communications and Networks (ICOCN), 2012 11th International Conference on. :1-4 Nov, 2012

    Relation: 2012 11th International Conference on Optical Communications and Networks (ICOCN)

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  9. 9
    مؤتمر
    Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

    المؤلفون: Kanda, Yoshihiko, Zama, Kunihiro, Kariya, Yoshiharu, Oota, Hironori, Kikuchi, Shunichi, Yamabe, Hideki, Nakamura, Kazuhiko

    المصدر: 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on. :1-5 Jun, 2010

    Relation: 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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  10. 10
    مؤتمر
    The reliability evaluation of (PTH hole) negative wetting phenomena in lead free process used OSP coated PCB by using thermal cycle testing

    المؤلفون: Liao, Meng-Chieh, Chen, Arch, Huang, Tzeng-Cherng, Luo, Te-Chun

    المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International. :1-3 Oct, 2010

    Relation: 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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