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1دورية أكاديمية
المصدر: IEEE Transactions on Transportation Electrification IEEE Trans. Transp. Electrific. Transportation Electrification, IEEE Transactions on. 10(1):1274-1285 Mar, 2024
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2مؤتمر
المؤلفون: Kulkarni, Ritwik V., Nagrani, Pranay P., Marconnet, Amy M.
المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-8 May, 2023
Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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3دورية أكاديمية
المؤلفون: McClure, P., Richmond, D., Poliks, M., Wilcox, J.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(2):171-176 Feb, 2023
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4دورية أكاديمية
المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 69(6):5660-5668 Jun, 2022
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5مؤتمر
المؤلفون: Jensen, Timothy, Lasky, Ronald
المصدر: 2020 Pan Pacific Microelectronics Symposium (Pan Pacific) Pan Pacific Microelectronics Symposium (Pan Pacific), 2020. :1-9 Feb, 2020
Relation: 2020 Pan Pacific Microelectronics Symposium (Pan Pacific)
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6دورية أكاديمية
المؤلفون: Choi, Mikyeong, Jung, Seung-BooAff1, IDs4004202300881z_cor2
المصدر: Journal of the Korean Physical Society. 83(6):444-454
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7دورية أكاديمية
المؤلفون: Bai, Ruixiang, Wei, Yangbing, Xu, Jiyuan, Li, Xiaobo, Li, Menglin, Zou, Ziwen, Huang, Xinyan, Liu, Chengyu, Sun, YiweiAff2, IDs122740235872y_cor9, Hao, MenglongAff1, IDs122740235872y_cor10
المصدر: Nano Research. 16(8):11389-11400
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8دورية أكاديمية
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(6):1000-1009 Jun, 2020
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9دورية أكاديمية
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(4):568-576 Apr, 2020
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10دورية أكاديمية
المؤلفون: Nighat Mumtaz, Yanchun Li, Ramón Artiaga, Zunaira Farooq, Amina Mumtaz, Qian Guo, Fakhr-Un Nisa
المصدر: Heliyon, Vol 10, Iss 3, Pp e25381- (2024)
مصطلحات موضوعية: Thermally conducive fillers, Through-plane thermal conductivity (k⊥), Thermally conductive polymer composites (TCPCs), Thermal interface materials (TIMs), Thermal management, Science (General), Q1-390, Social sciences (General), H1-99
وصف الملف: electronic resource