المؤلفون: Zhao, H., Zhang, X., Li, J., Zhang, F., Zhao, W., Zhang, Y., Gerada, D., Zhang, H.

المصدر: IEEE Transactions on Transportation Electrification IEEE Trans. Transp. Electrific. Transportation Electrification, IEEE Transactions on. 10(1):1274-1285 Mar, 2024

المؤلفون: Kulkarni, Ritwik V., Nagrani, Pranay P., Marconnet, Amy M.

المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-8 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: McClure, P., Richmond, D., Poliks, M., Wilcox, J.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(2):171-176 Feb, 2023

المؤلفون: Nam, H., Kim, J., Jeon, J., Jhon, H.

المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 69(6):5660-5668 Jun, 2022

المؤلفون: Jensen, Timothy, Lasky, Ronald

المصدر: 2020 Pan Pacific Microelectronics Symposium (Pan Pacific) Pan Pacific Microelectronics Symposium (Pan Pacific), 2020. :1-9 Feb, 2020

Relation: 2020 Pan Pacific Microelectronics Symposium (Pan Pacific)

المؤلفون: Choi, Mikyeong, Jung, Seung-Boo^{Aff1, IDs4004202300881z_cor2}

المصدر: Journal of the Korean Physical Society. 83(6):444-454

المؤلفون: Bai, Ruixiang, Wei, Yangbing, Xu, Jiyuan, Li, Xiaobo, Li, Menglin, Zou, Ziwen, Huang, Xinyan, Liu, Chengyu, Sun, Yiwei^{Aff2, IDs122740235872y_cor9}, Hao, Menglong^{Aff1, IDs122740235872y_cor10}

المصدر: Nano Research. 16(8):11389-11400

المؤلفون: Chen, C., Su, M., Ma, R., Hou, F., Cao, L., Li, J.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(6):1000-1009 Jun, 2020

المؤلفون: Lin, C., Won, Y.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(4):568-576 Apr, 2020

المؤلفون: Nighat Mumtaz, Yanchun Li, Ramón Artiaga, Zunaira Farooq, Amina Mumtaz, Qian Guo, Fakhr-Un Nisa

المصدر: Heliyon, Vol 10, Iss 3, Pp e25381- (2024)

مصطلحات موضوعية: Thermally conducive fillers, Through-plane thermal conductivity (k⊥), Thermally conductive polymer composites (TCPCs), Thermal interface materials (TIMs), Thermal management, Science (General), Q1-390, Social sciences (General), H1-99

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2405844024014129; https://doaj.org/toc/2405-8440

URL الوصول: https://doaj.org/article/e002ea95bf34474cb4d973e59129c410