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المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(9):5425-5431 Sep, 2024

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المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 34(5):1-5 Aug, 2024

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المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 34(5):1-4 Aug, 2024

المؤلفون: Kobayashi, H., Nakada, Y., Oike, S., Saotome, H., Miyagi, D., Tsuda, M.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 34(5):1-5 Aug, 2024

المؤلفون: Chen, X., Xu, J., Mao, S., He, Y., Gao, J., Liu, W., Sun, X., Wang, G., Zhao, C., Luo, J.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 45(7):1281-1284 Jul, 2024

المؤلفون: Wang, Qi, Fatima, Mizrab, Yang, Lijun, Ren, Chengjun, Li, Yuchen, Liao, Ruijin, Zhao, Xuetong, Kang, Shenglin

المصدر: 2024 IEEE International Conference on High Voltage Engineering and Applications (ICHVE) High Voltage Engineering and Applications (ICHVE), 2024 IEEE International Conference on. :1-4 Aug, 2024

Relation: 2024 IEEE International Conference on High Voltage Engineering and Applications (ICHVE)

المؤلفون: Hossain, M.J., Pebrianti, D., Bayuaji, L., Samad, R.

المصدر: 2024 9th International Conference on Mechatronics Engineering (ICOM) Mechatronics Engineering (ICOM), 2024 9th International Conference on. :145-150 Aug, 2024

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المؤلفون: Li, Liyuan, Li, Jinhui, Lv, Xialei, Sun, Rong, Zhang, Guoping

المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)