المؤلفون: Vandevelde, Bart, Cox, Kevin, Moloudi, Reza, Labie, Riet, Krantz, Jason, Borden, Matt, Vanstreels, Kris, Gonzalez, Mario

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-5 Sep, 2023

Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Liu, Yang, Chen, Chuantong, Nakayama, Koji S., Ueshima, Minoru, Sakamoto, Takeshi, Takuya, Naoe, Nishikawa, Hiroshi, Suganuma, Katsuaki

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-3 Sep, 2023

Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Takahashi, Masaki, Jorgensen, Jannick Kjaer, Jorgensen, Asger Bjorn, Munk-Nielsen, Stig, Uhrenfeldt, Christian

المصدر: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) Applied Power Electronics Conference and Exposition (APEC), 2023 IEEE. :2668-2675 Mar, 2023

Relation: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC)

المؤلفون: Morzhukhina, A. V., Alifanov, O. M., Budnik, S. A., Nenarokomov, A. V., Titov, D. M., Delfini, A., Pastore, R.^{Aff2, IDs42496023001870_cor7}, Santoni, F., Albano, M., Marchetti, M.

المصدر: Aerotecnica Missili & Spazio: Journal of Aerospace Science, Technologies & Systems. 103(1):3-15

المؤلفون: Xiaorui, Bie, Xudong, Zou, Xingyin, Xiong, Zheng, Wang, Wuhao, Yang, Zhitian, Li

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-7 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Noh, Hyunggyun, Lee, Kyungwoo, Bae, Jinsu, Hwang, Yuchul, Kim, Hoosung, Pae, Sangwoo

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1754-1758 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Pastore, Roberto^Aff3, Delfini, Andrea^Aff3, Albano, Marta^Aff4, Santoni, Fabio^Aff3, Piergentili, Fabrizio^Aff5, Marchetti, Mario^Aff3

المساهمون: Pakseresht, Amirhossein, editor^Aff1, Amirtharaj Mosas, Kamalan Kirubaharan, editor^Aff2

المصدر: Ceramic Coatings for High-Temperature Environments : From Thermal Barrier to Environmental Barrier Applications. :385-405

المؤلفون: Wang, Rui, Cai, Lingfeng, Zhang, Jian, Huang, Xiaoyan, Fang, Youtong

المصدر: 2021 IEEE 4th Student Conference on Electric Machines and Systems (SCEMS) Electric Machines and Systems (SCEMS), 2021 IEEE 4th Student Conference on. :1-6 Dec, 2021

Relation: 2021 IEEE 4th Student Conference on Electric Machines and Systems (SCEMS)

المؤلفون: Li, Wenqi, Xing, Chaoyang, Zhang, Jianfeng, Wang, Ziji, Su, Zhaoxi, Luo, Bin, Shang, Jintang

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Adinolfi, Giovanna, Ciavarella, Roberto, Ricca, Antonio, Merola, Angelo, Valenti, Maria, Graditi, Giorgio

المصدر: 2021 IEEE International Conference on Environment and Electrical Engineering and 2021 IEEE Industrial and Commercial Power Systems Europe (EEEIC / I&CPS Europe) Environment and Electrical Engineering and 2021 IEEE Industrial and Commercial Power Systems Europe (EEEIC / I&CPS Europe), 2021 IEEE International Conference on. :1-4 Sep, 2021

Relation: 2021 IEEE International Conference on Environment and Electrical Engineering and 2021 IEEE Industrial and Commercial Power Systems Europe (EEEIC / I&CPS Europe)