المؤلفون: Cong, S., Zhang, W.W., Liu, P., Han, Y.N., Tian, Y.H.

المصدر: In Microelectronics Journal March 2022 121

المؤلفون: Tian, Y.H., Lum, I., Won, S.J., Park, S.H., Jung, J.P., Mayer, M., Zhou, Y.

المصدر: 2005 6th International Conference on Electronic Packaging Technology Electronics Packaging Technology Electronic Packaging Technology, 2005 6th International Conference on. :389-393 2005

Relation: 2005 6th International Conference on Electronics Packaging Technology

المؤلفون: Ding, Y., Wang, C.Q., Tian, Y.H.

المصدر: Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Electronic packaging technology Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on. :377-380 2003

Relation: ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings

المؤلفون: Cao, Y.Y., Xiang, X., Song, J., Tian, Y.H., Wang, M.Y., Wang, X.W., Li, M., Huang, Z., Wu, Y., Wu, T., Wu, Y.Q., Hu, Y.H.

المصدر: In Journal of Affective Disorders 1 December 2019 259:386-391

المؤلفون: Zhang, W.W., Cong, S., Huang, Y., Tian, Y.H.

المصدر: In Journal of Materials Processing Tech. October 2017 248:64-71

المؤلفون: Zhou, X.Q., Yu, D.Y., Shao, X.Y., Wang, S., Tian, Y.H.

المصدر: In Composite Structures January 2015 119:487-504

المؤلفون: Zhou, X.Q., Yu, D.Y., Shao, Xinyu, Wang, S., Tian, Y.H.

المصدر: In Thin-Walled Structures September 2014 82:115-123

المؤلفون: Tian, Y.H., Su, G.H., Wang, J., Tian, W.X., Qiu, S.Z.

المصدر: In Progress in Nuclear Energy September 2013 68:177-187

المؤلفون: Wang, J., Tian, W.X., Tian, Y.H., Su, G.H., Qiu, S.Z.

المصدر: In Progress in Nuclear Energy March 2013 63:34-48

المؤلفون: Hang, C.J., Wang, C.Q., Tian, Y.H., Mayer, M., Zhou, Y.

المصدر: In Microelectronic Engineering 2008 85(8):1815-1819