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1دورية أكاديمية
المؤلفون: I-Hsin Tseng, Po-Ning Hsu, Tien-Lin Lu, K.N. Tu, Chih Chen
المصدر: Results in Physics, Vol 24, Iss , Pp 104154- (2021)
مصطلحات موضوعية: Organic materials, nanotwinned Cu, Electromigration, Oxidation, RDLs, Physics, QC1-999
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Tien-Lin Lu, Yu-An Shen, John A. Wu, Chih Chen
المصدر: Materials, Vol 13, Iss 1, p 134 (2019)
مصطلحات موضوعية: nanotwinned cu, grain growth, preferred orientation, electrodeposition, thermal annealing, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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3مؤتمرFabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices
المؤلفون: Chih Chen, Chien-Min Liu, Tien-Lin Lu, Han-wen Lin, Yi-Cheng Chu, Chia-Ling Lu, Jing-Ye Juang, Kuan-Neng Chen, Tu, K. N.
المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 IEEE International. :27-27 May, 2016
Relation: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)
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4
المؤلفون: John A. Wu, Chih Chen, Tien Lin Lu
المصدر: Crystal Growth & Design. 20:1485-1490
مصطلحات موضوعية: Fabrication, Materials science, 010405 organic chemistry, business.industry, Annealing (metallurgy), Crystal orientation, chemistry.chemical_element, General Chemistry, 010402 general chemistry, Condensed Matter Physics, 01 natural sciences, Copper, Grain size, 0104 chemical sciences, chemistry, Pulse plating, Optoelectronics, General Materials Science, Wafer, Electroplating, business
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5
المؤلفون: I. Hsin Tseng, King-Ning Tu, Po Ning Hsu, Tien Lin Lu, Chih Chen
المصدر: Results in Physics, Vol 24, Iss, Pp 104154-(2021)
مصطلحات موضوعية: Materials science, QC1-999, Copper interconnect, General Physics and Astronomy, chemistry.chemical_element, 02 engineering and technology, Dielectric, 01 natural sciences, Electromigration, Electrical resistivity and conductivity, Oxidation, 0103 physical sciences, Mechanical strength, Redistribution (chemistry), RDLs, Composite material, 010302 applied physics, Physics, Organic materials, 021001 nanoscience & nanotechnology, Copper, chemistry, 0210 nano-technology, nanotwinned Cu, Polyimide
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6
المؤلفون: Yu-An Shen, John A. Wu, Chih Chen, Tien Lin Lu
المصدر: Materials, Vol 13, Iss 1, p 134 (2019)
Materials
Volume 13
Issue 1مصطلحات موضوعية: thermal annealing, Materials science, Annealing (metallurgy), preferred orientation, chemistry.chemical_element, 02 engineering and technology, Abnormal grain growth, lcsh:Technology, 01 natural sciences, Article, 0103 physical sciences, General Materials Science, grain growth, Composite material, lcsh:Microscopy, Electroplating, nanotwinned cu, lcsh:QC120-168.85, 010302 applied physics, lcsh:QH201-278.5, lcsh:T, Direct current, 021001 nanoscience & nanotechnology, Copper, Grain size, Surface energy, Grain growth, chemistry, lcsh:TA1-2040, electrodeposition, lcsh:Descriptive and experimental mechanics, lcsh:Electrical engineering. Electronics. Nuclear engineering, lcsh:Engineering (General). Civil engineering (General), 0210 nano-technology, lcsh:TK1-9971
وصف الملف: application/pdf
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7
المؤلفون: Chien Min Liu, Tien-Lin Lu, Chih Chen, Yi-Sa Huang, Chiu Wei-Lan, Jui Chao Kuo, King-Ning Tu, Hsiang-Yao Hsiao, Chia-Ling Lu, Han-wen Lin, Taochi Liu
المصدر: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
مصطلحات موضوعية: Materials science, Fabrication, business.industry, Annealing (metallurgy), Metallurgy, Three-dimensional integrated circuit, Optoelectronics, Crystal growth, Wafer, Abnormal grain growth, Electroplating, Microstructure, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a9c59e887fbbc8b86b47fc9b64cb70dc
https://doi.org/10.1109/icep-iaac.2015.7111069 -
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المؤلفون: Chih Chen, Tien Lin Lu, Tao Chi Liu, Chien Min Liu, Yi Sa Huang, Han Wen Lin, Jui Chao Kuo, King-Ning Tu, Hsiang Yao Hsiao, Chia Ling Lu
المصدر: NPG Asia Materials. 6:e135-e135
مصطلحات موضوعية: Materials science, Single crystal growth, Annealing (metallurgy), chemistry.chemical_element, Nanotechnology, Condensed Matter Physics, Copper, chemistry, Modeling and Simulation, General Materials Science, Wafer, Composite material, Electroplating, Anisotropy
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9مؤتمر
المؤلفون: Wei-Lan Chiu, Lu, Chia-Ling, Lin, Han-Wen, Liu, Chien-Min, Huang, Yi-Sa, Tien-Lin Lu, Liu, Tao-Chi, Hsiao, Hsiang-Yao, Chen, Chih, Kuo, Jui-Chao, Tu, King-Ning
المصدر: 2015 International Conference on Electronic Packaging & iMAPS All Asia Conference (ICEP-IAAC); 2015, p518-522, 5p
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10
المؤلفون: Cheng-Tzu Kuo, Ing-Jar Hsieh, Yu-Cheng Liu, Tien-Lin Lu, Tai-Jui Wang, Chien-Hung Wu
المصدر: Japanese Journal of Applied Physics. 50:06GF12
مصطلحات موضوعية: Materials science, Physics and Astronomy (miscellaneous), Silicon, business.industry, Low-temperature polycrystalline silicon, Transistor, General Engineering, General Physics and Astronomy, chemistry.chemical_element, Nitride, law.invention, Non-volatile memory, chemistry, Nanocrystal, law, Thin-film transistor, Optoelectronics, business, Low voltage
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