المؤلفون: Zhong-Yi Wu, Pei-Hsuan Wu, Tim Chiou, Chen, Richard, Lee, Robert, Lwo, Ben-Je

المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :343-346 Oct, 2012

Relation: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Richard Chen, Ben-Je Lwo, Tim Chiou, Robert Lee, Pei-Hsuan Wu, Zhong-Yi Wu

المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

مصطلحات موضوعية: Stress (mechanics), Materials science, Power diode, Thermal resistance, Hardware_INTEGRATEDCIRCUITS, Ansys software, Electronic engineering, Mechanical engineering, Thermal simulation, Hardware_PERFORMANCEANDRELIABILITY, Thermal management of electronic devices and systems, Transient (oscillation), Material properties

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6f2b5264d19f30561eed097694b1d1c8
https://doi.org/10.1109/impact.2012.6420256

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