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المؤلفون: Matthias Fettke, Timo Kubsch, Anne Fisch, Mohammed Ziad Baa, Thorsten Teutsch, Tobias Seifert, Mario Baum, Franz Selbmann, Soumya Deep Paul, Frank Roscher, Kerstin Kreyssig, Maik Wiemer, Harald Kuhn
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::82ad26da096d5408604cccfe22334cf9
https://doi.org/10.1109/ectc51906.2022.00229 -
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المؤلفون: Rojhat Baba, Kim Hoey Yeoh, Vinith Bejugam, Robert Thalmann, Matthias Fettke, Georg Friedrich, Timo Kubsch, Thorsten Teutsch
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Interconnection, Materials science, Scanning electron microscope, Soldering, Polishing, Electroless nickel immersion gold, Substrate (electronics), Composite material, Focused ion beam, Layer (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::14a735e6efbc704fa6c50bd3aefa4d5d
https://doi.org/10.1109/ectc32696.2021.00084 -
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المؤلفون: Georg Friedrich, Matthias Fettke, Vinith Bejugam, Timo Kubsch, Thorsten Teutsch, Alexander Frick
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, business.industry, Reflow oven, Stacking, Solder paste, Chip, law.invention, Capacitor, Stack (abstract data type), law, Soldering, Optoelectronics, Resistor, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0bfca9db0c339985109ceb43c861be14
https://doi.org/10.1109/ectc32696.2021.00329 -
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المؤلفون: Matthias Fettke, Andrej Kolbasow, Thorsten Teutsch, Timo Kubsch, Alexander Frick, Sergej Walter, Vinith Bejugam
المصدر: 2020 International Wafer Level Packaging Conference (IWLPC).
مصطلحات موضوعية: Interconnection, Materials science, Wafer-scale integration, Stack (abstract data type), Soldering, Stacking, Process window, Direct shear test, Composite material, Chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d563d1d84f3f3c00423a137985808d31
https://doi.org/10.23919/iwlpc52010.2020.9375852 -
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المؤلفون: Matthias Fettke, Timo Kubsch, Thorsten Teutsch, Andrej Kolbasow, Vinith Bejugam
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, business.industry, Semiconductor package, 02 engineering and technology, 010402 general chemistry, 021001 nanoscience & nanotechnology, Laser, 01 natural sciences, Focused ion beam, 0104 chemical sciences, law.invention, Stack (abstract data type), law, Soldering, Optoelectronics, Direct shear test, Laser bonding, Photonics, 0210 nano-technology, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::418a5b6e07a5bb92b41df910484cf4a1
https://doi.org/10.1109/ectc32862.2020.00302 -
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المؤلفون: Vinith Bejugam, Alexander Frick, Thorsten Teutsch, Yu-Chung Wang, Juha Rantala, Timo Kubsch, Andrej Kolbasow, Matthias Fettke
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, business.industry, Polishing, Phosphor, Electroluminescence, Laser, law.invention, law, Soldering, Optoelectronics, Process window, business, Quantum well, Light-emitting diode
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::886a6855a476f5e9d190808fb2ce1944
https://doi.org/10.1109/ectc32862.2020.00301 -
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المؤلفون: Matthias Fettke, Thorsten Teutsch, Timo Kubsch, Andrej Kolbasow, Vinith Bejugam, Alexander Frick
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, Flatness (systems theory), Electroless nickel immersion gold, 02 engineering and technology, Temperature cycling, 021001 nanoscience & nanotechnology, Chip, Laser, 01 natural sciences, law.invention, 010309 optics, Printed circuit board, law, Soldering, 0103 physical sciences, Laser bonding, Composite material, 0210 nano-technology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::86f1684df3ce08761f79c63efda494b7
https://doi.org/10.1109/ectc32862.2020.00165 -
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المؤلفون: Georg Friedrich, Thorsten Teutsch, Matthias Fettke, Andrej Kolbasow, Timo Kubsch
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Materials science, Silicon, business.industry, Stacking, chemistry.chemical_element, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Thermocompression bonding, 021001 nanoscience & nanotechnology, Chip, Laser assisted, 01 natural sciences, Semiconductor, Stack (abstract data type), chemistry, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, 0210 nano-technology, business, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b7c45b687021dd543b292e5ab1427338
https://doi.org/10.1109/ectc.2019.00039