يعرض 1 - 10 نتائج من 40 نتيجة بحث عن '"Tippabhotla, Sasi Kumar"', وقت الاستعلام: 0.90s تنقيح النتائج
  1. 1
    مؤتمر
    Dielectric Stack Optimization for Die-level Warpage Reduction for Chip-to-Wafer Hybrid Bonding

    المؤلفون: Rao, B.S.S. Chandra, Kumar, Mishra Dileep, Sekhar, Vasarla Nagendra, Daniel, Ismael Cereno, Tippabhotla, Sasi Kumar, Chong, Ser Choong, C, Hemanth Kumar, Rao, Vempati Srinivasa

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :62-68 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Multi-Chip Stacked Memory Module Development using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications

    المؤلفون: Sekhar, Vasarla Nagendra, Kumar, Mishra Dileep, Tippabhotla, Sasi Kumar, Rao, B. S. S. Chandra, Daniel, Ismael Cereno, Chong, Ser Choong, Rao, Vempati Srinivasa

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2024-2030 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Evaluation of C2W hybrid bonding performance with SiO2/SiCN passivation layers at the interface using finite element simulations

    المؤلفون: Tippabhotla, Sasi Kumar, Ji, Lin, Choong, Chong Ser

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :1053-1058 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  4. 4
    مؤتمر
    On the effect of partial underfilling on the fatigue life of flip-chip micro-solder bumps in a heterogeneously integrated TSI package using finite element simulations

    المؤلفون: Tippabhotla, Sasi Kumar, Ji, Lin

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :200-206 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer

    المؤلفون: Lim, Teck Guan, Zho, Lin, Tippabhotla, Sasi Kumar, Lin, Ji, Chinq, Jong Ming, Wu, JiaQi, Gongyue, Tang, Ching, Eva Wai Leong, Ng, Yong Chyn, Chui, King Jien, Lu, Wei Jia, Goh, Chee Heng, Lin Pek, Sek, Loh, Jun Wei Agnes

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1838-1843 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    Numerical Simulations to Assist Chip-to-Wafer Hybrid Bonding Process Development

    المؤلفون: Tippabhotla, Sasi Kumar, Ji, Lin, Choong, Chong Ser

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :650-654 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  7. 7
    مؤتمر
    Comprehensive study on effect of chip layout and mold thickness on die shift and warpage for FOWLP applications

    المؤلفون: Lim, Sharon Pei Siang, Chong, Ser Choong, Seit, Wen Wei, Soh, Jacob Jordan, Tippabhotla, Sasi Kumar, Rao, Vempati Srinivasa

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :945-950 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  8. 8
    مؤتمر
    Numerical Simulation of Cu/Polymer-Dielectric Hybrid Bonding Process using Finite Element Analysis

    المؤلفون: Tippabhotla, Sasi Kumar, Ji, Lin, Han, Yong

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1695-1703 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Numerical Evaluation on SiO2 Based Chip to Wafer Hybrid Bonding Performance by Finite Element Analysis

    المؤلفون: Ji, Lin, Tippabhotla, Sasi Kumar

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :524-530 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  10. 10
    مؤتمر
    A comparative study of stress-based and fracture mechanics-based finite element simulation approaches for RDL based wafer level package

    المؤلفون: Tippabhotla, Sasi Kumar, Ji, Lin, Chai, Tai Chong

    المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :568-572 Dec, 2021

    Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

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