المؤلفون: Braun, T., Becker, K.-F., Hoelck, O., Kahle, R., Woehrmann, M., Toepper, M., Ndip, I., Maass, U., Tschoban, C., Aschenbrenner, R., Voges, S., Lang, K.-D.

المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :247-251 Apr, 2018

Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Braun, T, Becker, K. -F., Hoelck, O., Voges, S., Woehrmann, M., Boettcher, L., Toepper, M., Stobbe, L., Aschenbrenner, R., Schneider-Ramelow, M., Lang, K. -D.

المصدر: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :9-9 May, 2019

Relation: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

المؤلفون: Wunderle, B., Manier, C.-A., Ras, M. Abo, Springborn, M., May, D., Oppermann, H., Toepper, M., Mrossko, R., Xhonneux, T., Caroff, T., Maurer, W., Mitova, R.

المصدر: 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on. :253-261 Sep, 2013

Relation: 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

المؤلفون: Zlatkin-Troitschanskaia, Olga^Aff5, Pant, Hans Anand^Aff6, Toepper, M.^Aff5, Lautenbach, Corinna^Aff7

المساهمون: Zlatkin-Troitschanskaia, Olga, editor^Aff1, Pant, Hans Anand, editor^Aff2, Toepper, Miriam, editor^Aff3, Lautenbach, Corinna, editor^Aff4

المصدر: Student Learning in German Higher Education : Innovative Measurement Approaches and Research Results. :1-6

المؤلفون: Hansen, U., Maus, S., Leib, J., Toepper, M.

المصدر: 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP) Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on. :237-241 May, 2010

Relation: 2010 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Maus, S., Hansen, U., Leib, J., Toepper, M.

المصدر: 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP) Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on. :242-246 May, 2010

Relation: 2010 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Fritzsch, T., Mrossko, R., Baumgartner, T., Toepper, M., Klein, M., Wolf, J., Wunderle, B., Reichl, H.

المصدر: 2009 IEEE International Conference on 3D System Integration 3D System Integration, 2009. 3DIC 2009. IEEE International Conference on. :1-8 Sep, 2009

Relation: 2009 IEEE International Conference on 3D System Integration (3DIC)

المؤلفون: Jung, Erik, Ostmann, A., Ramm, P., Wolf, J., Toepper, M., Wiemer, M.

المصدر: 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on. :119-122 Apr, 2008

Relation: 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (MEMS/MOEMS)

المؤلفون: Zoschke, K., Wolf, J., Ehrmann, O., Toepper, M., Reichl, H.

المصدر: 2007 9th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th. :295-302 Dec, 2007

Relation: 2007 9th Electronics Packaging Technology Conference

المؤلفون: Maik Wiemer, Chenping Jia, Toepper, M., Hauck, K.

المصدر: 2006 1st Electronic Systemintegration Technology Conference Electronics Systemintegration Technology Conference, 2006. 1st. 2:1401-1405 Sep, 2006

Relation: 2006 1st Electronic Systemintegration Technology Conference