المؤلفون: Liu, P., Feng, H., Ranjith, K., Wong, T.N., Toh, K.C.

المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :763-766 Dec, 2018

Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Wang, Z.Y., Wong, T.N., Duan, F., Toh, K.C., Choo, K.F., Tan, S.P., Loh, C.V., Leong, Y.W.

المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :511-514 Dec, 2012

Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

المؤلفون: Khan, N., Pinjala, D., Toh, K.C.

المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :273-280 2004

Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)

المؤلفون: Yap, Y.F., Toh, K.C., Wong, T.N., Chai, J.C.

المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :575-580 2004

Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)

المؤلفون: Toh, K.C., Tutuncu, R.H., Todd, M.J.

المصدر: 2004 IEEE International Conference on Robotics and Automation (IEEE Cat. No.04CH37508) Computer aided control systems design Computer Aided Control Systems Design, 2004 IEEE International Symposium on. :290-296 2004

Relation: 2004 IEEE International Symposium on Computer Aided Control Systems Design

المؤلفون: Zhang, H.Y., Pinjala, D., Joshi, Y.K., Wong, T.N., Toh, K.C., Iyer, M.K.

المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on. 2:640-647 Vol.2 2004

Relation: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems

المؤلفون: Zhang, H.Y., Pinjala, D., Joshi, Y.K., Wong, T.N., Toh, K.C.

المصدر: 53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :431-437 2003

Relation: 53rd Electronic Components and Technology Conference, 2003. Proceedings.

المؤلفون: Chen, X.Y., Toh, K.C., Chai, J.C., Wong, T.N., Pinjala, D., Navas, O.K., Ganesh, Hengyun Zhang, Kripesh, V.

المصدر: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :633-637 2003

Relation: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)

المؤلفون: Lin, T.Y., Davison, K.L., Leong, W.S., Chua, S., Pan, J.S., Chai, J.W., Toh, K.C., Tjiu, W.C.

المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :1586-1594 2002

Relation: Proceedings of 52nd Electronic Components and Technology Conference

المؤلفون: Chen, X.Y., Toh, K.C., Chai, J.C., Pinjala, D.

المصدر: 4th Electronics Packaging Technology Conference, 2002. Electronics packaging technology Electronics Packaging Technology Conference, 2002. 4th. :380-384 2002

Relation: Proceedings 4th Electronics Packaging Technology Conference (EPTC 2002)