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المؤلفون: Douglas B. Hunt, Timothy W. Kemerer, William J. Murphy, Stephane Lariviere, Cathryn Christiansen, Edward C. Cooney, Tony Stamper, Michael Coster, Jeffrey P. Gambino, Gregory U'Ren, Jonathan D. Chapple-Sokol, Richard J. Rassel, Stephane Brandon, Tom C. Lee
المصدر: 2014 IEEE International Reliability Physics Symposium.
مصطلحات موضوعية: Materials science, chemistry, Aluminium, Stress migration, Metallurgy, Copper plating, chemistry.chemical_element, Tungsten, Composite material, Copper, Highly sensitive
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cc37b05c83ed510eac38669505ebe4c5
https://doi.org/10.1109/irps.2014.6860580