المؤلفون: Yasunaga, Shun, Misumi, Kei, Mizushima, Ayako, Toyokura, Atsushi, Ota, Etsuko, Inoue, Yurie, Fujiwara, Makoto, Kawai, Noriko, Yoda, Mitsuhiro, Tsuboi, Shinji, Sawamura, Tomoki, Higo, Akio, Nakane, Ryosho, Ochiai, Yukinori, Mita, Yoshio

المصدر: 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS) Microelectronic Test Structures (ICMTS), 2024 IEEE 36th International Conference on. :1-4 Apr, 2024

Relation: 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS)

المؤلفون: Hwang, Gilgueng, Kim, Beomjoon, Toyokura, Atsushi, Mita, Yoshio, Higo, Akio

المصدر: 2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2021 Symposium on. :1-4 Aug, 2021

Relation: 2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

المؤلفون: Yamaguchi, Takafumi, Usami, Naoto, Misumi, Kei, Toyokura, Atsushi, Higo, Akio, Ono, Shimpei, Hwang, Gilgueng, Larrieu, Guilhem, Ikeuchi, Yoshiho, Tixier-Mita, Agnes, Saito, Ken, Levi, Timothee, Mita, Yoshio

المصدر: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) SSolid-State Sensors, Actuators and Microsystems (Transducers), 2021 21st International Conference on. :18-21 Jun, 2021

Relation: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

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