المؤلفون: Shi, Ru-Zeng, Zhou, Min-Bo, Zhang, Xin-Ping

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2305-2310 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Yang, Miao, Zhang, Teng, Ding, Ran, Qiao, Zhixia, Liu, Chenxi^{Aff1, IDs11665023079970_cor5}, Liu, Yongchang^{Aff1, IDs11665023079970_cor6}

المصدر: Journal of Materials Engineering and Performance. 33(2):724-740

المؤلفون: Singh Nobeen, N., Yan, G., Gan, C.L., Chen, Z.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(10):1604-1610 Oct, 2020

المؤلفون: Johannes L. Otto, Lukas M. Sauer, Malte Brink, Thorge Schaum, Lars A. Lingnau, Marina Macias Barrientos, Frank Walther

المصدر: Materials & Design, Vol 235, Iss , Pp 112401- (2023)

مصطلحات موضوعية: Transient liquid phase (TLP) bonding, Intermetallic phases, Failure mechanism, Microstructure-property correlations, 3D-FIB-SEM, Precipitation morphology, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S026412752300816X; https://doaj.org/toc/0264-1275

URL الوصول: https://doaj.org/article/0032b447f18142c7af9af5a6c1bf5f8e

المؤلفون: Somidin, Flora^Aff10, Said, Rita Mohd^Aff10, Saud, Norainiza^Aff10, Salleh, Mohd Arif Anuar Mohd^Aff10

المساهمون: Bergmann, Carlos P., Series Editor^Aff1, Frade, Jorge R, Editorial Board Member^Aff2, Carda Castelló, Juan Bautista, Editorial Board Member^Aff3, Bolmaro, Raul, Editorial Board Member^Aff4, Esposito, Vincenzo, Editorial Board Member^Aff5, Salleh, Mohd Arif Anuar Mohd, editor^Aff6, Abdul Aziz, Mohd Sharizal, editor^Aff7, Jalar, Azman, editor^Aff8, Izwan Ramli, Mohd Izrul, editor^Aff9

المصدر: Recent Progress in Lead-Free Solder Technology : Materials Development, Processing and Performances. :95-112

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المؤلفون: Hikichi, K., Matsuzaki, S., Nonomura, Y., Funabashi, H., Hata, Y., Esashi, M., Tanaka, S.

المصدر: 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII) Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on. :1071-1074 Jun, 2013

Relation: 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)

المؤلفون: Rodriguez, R. I., Ibitayo, D., Quintero, P. O.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(4):549-557 Apr, 2013

المؤلفون: Tarai, U. K., Robi, P. S., Pal, Sukhomay^Aff1

المصدر: Acta Metallurgica Sinica (English Letters). 33(12):1666-1680

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