المؤلفون: Conseil-Gudla, H., Li, F., Ambat, R.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 21(4):594-602 Dec, 2021

المؤلفون: Rajan Ambat, Helene Conseil-Gudla, Feng Li

المصدر: Conseil-Gudla, H, Li, F & Ambat, R 2021, ' Reflow Residues on Printed Circuit Board Assemblies and Interaction with Humidity ', IEEE Transactions on Device and Materials Reliability, vol. 21, no. 4, pp. 594-602 . https://doi.org/10.1109/TDMR.2021.3120941

مصطلحات موضوعية: Conductivity, Absorption of water, Materials science, Humidity, food and beverages, Reflow, Trapped residues, Electronic, Optical and Magnetic Materials, Printed circuit board, Standoff height, Water absorption, Board, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, Components

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e02985371a1c95435d8c86628a9f535d
https://orbit.dtu.dk/en/publications/cc32000e-b31b-4117-bf26-db71813f793d

المصدر: Conseil-Gudla , H , Li , F & Ambat , R 2021 , ' Reflow Residues on Printed Circuit Board Assemblies and Interaction with Humidity ' , IEEE Transactions on Device and Materials Reliability , vol. 21 , no. 4 , pp. 594-602 .

مصطلحات الفهرس: Board, Components, Conductivity, Humidity, Reflow, Standoff height, Trapped residues, Water absorption, article

URL: https://orbit.dtu.dk/en/publications/cc32000e-b31b-4117-bf26-db71813f793d
https://doi.org/10.1109/TDMR.2021.3120941
https://backend.orbit.dtu.dk/ws/files/262055246/Reflow_Residues_on_Printed_Circuit_Board_Assemblies_and_Interaction_with_Humidity_accepted_version_1_.pdf