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Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Yang, Hsiu-Hsiung, Tsai, Yu-Pin, Lin, Chiu-Cheng, Yen, Ching-Yuan, Lee, Jen-Kuei, Hsieh, Wei-Ming, Wu, Cheng-Wen

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المصدر: In International Communications in Heat and Mass Transfer 2011 38(2):179-183

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