المؤلفون: Yi-Shao Lai, Pao-Huei Chang-Chien, Chi-Wen Chang, Tsung-Yueh Tsai, Sung-Ching Hung, Tseng, Andy, Keiji Takai, Tetsuyuki Hirashima

المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :964-967 May, 2008

Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)

المؤلفون: Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai

المصدر: 2005 7th Electronic Packaging Technology Conference Electronics Packaging Technology Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th. 1:8 pp. 2005

Relation: Proceedings of 7th Electronics Packaging Technology Conference

المؤلفون: Tsung-Yueh Tsai, Wen-Yun Chen

المصدر: MDPI, Sustainability. 14(24):1-10

الإتاحة: https://ideas.repec.org/a/gam/jsusta/v14y2022i24p16992-d1007451.html

المؤلفون: Ching-Hsiang Kuo, Cheng-Fang Ho, Yi-Jyun Lin, Wei-Yao Hsu, Zong-Ru Yu, Tsung-Yueh Tsai, Wei-Ren Huang, Hong-Tsu Young

المصدر: The International Journal of Advanced Manufacturing Technology. 108:1367-1380

مصطلحات موضوعية: 0209 industrial biotechnology, Materials science, Offset (computer science), Waviness, Image quality, Mechanical Engineering, Polishing, 02 engineering and technology, Surface finish, Industrial and Manufacturing Engineering, Computer Science Applications, 020901 industrial engineering & automation, Control and Systems Engineering, Numerical control, Spatial frequency, Composite material, Software, Surface finishing

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::24c582d05f49756005021053d1aa4267
https://doi.org/10.1007/s00170-020-05388-6

المؤلفون: Yung‐Chung Chen, Tsung‐Yueh Tsai, Guan‐Wei Huang, Ming‐Chang Hong, Cheng‐Hsien Tsai, I‐Chi Li

المصدر: Journal of Applied Polymer Science. 137:49581

مصطلحات موضوعية: Sodium Acrylate, Aqueous solution, Adsorption, Polymers and Plastics, Chemistry, Materials Chemistry, General Chemistry, Ammonium nitrogen, Surfaces, Coatings and Films, Nuclear chemistry

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ce9072e244410c0d948d1899a3673dd5
https://doi.org/10.1002/app.49581

المؤلفون: Chih-Ju G. Jou, Chien Li Lee, Tsung-Yueh Tsai, Chin Chung Lo

المصدر: Sensors and Materials. 32:275

مصطلحات موضوعية: Materials science, chemistry, Inorganic chemistry, chemistry.chemical_element, General Materials Science, Platinum, Instrumentation, Microwave, Catalysis, Rhodium, Palladium, Syngas

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fadf5ed2ef7d0c04686541d65a4f1fa7
https://doi.org/10.18494/sam.2020.2579

المؤلفون: Shih-Pu Huang, Yi-Jyun Lin, Wei-Ren Huang, Wei-Yao Hsu, Hong-Tsu Young, Zong-Ru Yu, Ching-Hsiang Kuo, Tsung-Yueh Tsai

المصدر: Astronomical Optics: Design, Manufacture, and Test of Space and Ground Systems.

مصطلحات موضوعية: Spherical aberration, Materials science, Optics, Fabrication, Aperture, business.industry, Numerical control, Process (computing), Polishing, Surface finish, business, Curvature

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e1af90badd6c6794ab85e4533303d8bc
https://doi.org/10.1117/12.2272529

المؤلفون: Chin Chung Lo, Chien Li Lee, Tsung-Yueh Tsai, Chih-Ju G. Jou

المصدر: Sensors & Materials; 2020, Vol. 32 Issue 1, Part 2, p275-281, 7p

مصطلحات موضوعية: RHODIUM catalysts, PALLADIUM, PRECIOUS metals, SYNTHESIS gas, IRON powder, IRON catalysts

المؤلفون: Tsung-Yueh Tsai, Wataru Nishijima, Mallampati Srinivasa Reddy, Satoshi Nakai, Tetsuji Okuda, Keisuke Kurose, Mitsumasa Okada

المصدر: Journal of Material Cycles and Waste Management. 12:326-331

مصطلحات موضوعية: Chromatography, Materials science, Bubble, Mixing (process engineering), chemistry.chemical_compound, Polyvinyl chloride, Combined treatment, chemistry, Chemical engineering, Mechanics of Materials, Polyethylene terephthalate, Surface modification, Froth flotation, Waste Management and Disposal

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0bcf01d2ae3a38378c282407d0e79196
https://doi.org/10.1007/s10163-010-0305-x

المؤلفون: Chin-Li Kao, Darko Popovic, T. Sze, James G. Mitchell, Jing Shi, Matthew Giere, Tsung-Yueh Tsai, Yi-Shao Lai, Bruce M. Guenin

المصدر: Microelectronics Reliability. 50:498-506

مصطلحات موضوعية: Very-large-scale integration, Engineering, Hardware_MEMORYSTRUCTURES, business.industry, Electrical engineering, Electronic packaging, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit, Proximity communication, Condensed Matter Physics, Chip, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, law, Hardware_INTEGRATEDCIRCUITS, System on a chip, Signal integrity, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4dec37f465468135409e9c66acffcbb8
https://doi.org/10.1016/j.microrel.2010.02.003